Global Patent Index - EP 2449487 A1

EP 2449487 A1 20120509 - METHOD FOR ESTIMATING THE LIFESPAN OF A DEEP-SUB-MICRON INTEGRATED ELECTRONIC CIRCUIT

Title (en)

METHOD FOR ESTIMATING THE LIFESPAN OF A DEEP-SUB-MICRON INTEGRATED ELECTRONIC CIRCUIT

Title (de)

VERFAHREN ZUR SCHÄTZUNG DER LEBENSDAUER EINER ELEKTRONISCHEN INTEGRIERTEN DEEP-SUBMICRON-SCHALTUNG

Title (fr)

PROCÉDÉ D'ESTIMATION DE LA DURÉE DE VIE D'UN CIRCUIT ÉLECTRONIQUE INTÉGRÉ DÉCANANOMÉTRIQUE ( "DEEP-SUB-MICRON" )

Publication

EP 2449487 A1 (FR)

Application

EP 10726535 A

Priority

  • EP 2010059317 W
  • FR 0954496 A

Abstract (en)

[origin: WO2011000888A1] The invention relates to a method for estimating the lifespan (TTFAPPLI) of a deep-sub-micron generation electronic integrated component, connected to a mechanism for detecting wear under previously defined specific conditions of use, said component being a commercially available one with very large-scale integration (VLSI), in particular sub-micronic.

IPC 8 full level

G06F 17/50 (2006.01); G01R 31/28 (2006.01); G06Q 90/00 (2006.01)

CPC (source: EP US)

G06F 30/367 (2020.01 - US); G06F 30/398 (2020.01 - US); G06Q 10/06 (2013.01 - EP US); G01R 31/2855 (2013.01 - EP US); G06F 2119/10 (2020.01 - US)

Citation (search report)

See references of WO 2011000888A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

WO 2011000888 A1 20110106; EP 2449487 A1 20120509; US 2012143557 A1 20120607; US 9058574 B2 20150616

DOCDB simple family (application)

EP 2010059317 W 20100630; EP 10726535 A 20100630; US 201013381112 A 20100630