EP 2449487 A1 20120509 - METHOD FOR ESTIMATING THE LIFESPAN OF A DEEP-SUB-MICRON INTEGRATED ELECTRONIC CIRCUIT
Title (en)
METHOD FOR ESTIMATING THE LIFESPAN OF A DEEP-SUB-MICRON INTEGRATED ELECTRONIC CIRCUIT
Title (de)
VERFAHREN ZUR SCHÄTZUNG DER LEBENSDAUER EINER ELEKTRONISCHEN INTEGRIERTEN DEEP-SUBMICRON-SCHALTUNG
Title (fr)
PROCÉDÉ D'ESTIMATION DE LA DURÉE DE VIE D'UN CIRCUIT ÉLECTRONIQUE INTÉGRÉ DÉCANANOMÉTRIQUE ( "DEEP-SUB-MICRON" )
Publication
Application
Priority
- EP 2010059317 W 20100630
- FR 0954496 A 20090701
Abstract (en)
[origin: WO2011000888A1] The invention relates to a method for estimating the lifespan (TTFAPPLI) of a deep-sub-micron generation electronic integrated component, connected to a mechanism for detecting wear under previously defined specific conditions of use, said component being a commercially available one with very large-scale integration (VLSI), in particular sub-micronic.
IPC 8 full level
G01R 31/28 (2006.01); G06F 17/50 (2006.01); G06Q 90/00 (2006.01)
CPC (source: EP US)
G06F 30/367 (2020.01 - US); G06F 30/398 (2020.01 - US); G06Q 10/06 (2013.01 - EP US); G01R 31/2855 (2013.01 - EP US); G06F 2119/10 (2020.01 - US)
Citation (search report)
See references of WO 2011000888A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2011000888 A1 20110106; EP 2449487 A1 20120509; US 2012143557 A1 20120607; US 9058574 B2 20150616
DOCDB simple family (application)
EP 2010059317 W 20100630; EP 10726535 A 20100630; US 201013381112 A 20100630