Global Patent Index - EP 2459762 A2

EP 2459762 A2 20120606 - METHOD FOR SINTERING THERMOELECTRIC MATERIALS

Title (en)

METHOD FOR SINTERING THERMOELECTRIC MATERIALS

Title (de)

VERFAHREN ZUM SINTERN VON THERMOELEKTRISCHEN MATERIALIEN

Title (fr)

PROCÉDÉ DE FRITTAGE DE MATÉRIAUX THERMOÉLECTRIQUES

Publication

EP 2459762 A2 20120606 (DE)

Application

EP 10742116 A 20100723

Priority

  • EP 09166477 A 20090727
  • EP 2010060713 W 20100723
  • EP 10742116 A 20100723

Abstract (en)

[origin: US2011020164A1] The process for producing, processing, sintering, pressing or extruding thermoelectric materials with heat treatment under inert gas or under reduced pressure at temperatures in the range from 100 to 900° C. comprises producing, processing, sintering, pressing or extruding in the presence of oxygen scavengers which form thermodynamically stable oxides in the presence of free oxygen under the production, processing, sintering, pressing or extrusion conditions and hence keep free oxygen away from the thermoelectric material.

IPC 8 full level

C22C 1/04 (2006.01)

CPC (source: EP US)

C04B 35/547 (2013.01 - EP US); C04B 35/64 (2013.01 - EP US); C04B 35/645 (2013.01 - EP US); C04B 35/6455 (2013.01 - EP US); C22C 1/047 (2023.01 - EP US); C22C 1/0483 (2013.01 - EP US); H10N 10/01 (2023.02 - US); H10N 10/851 (2023.02 - EP US); B22F 2998/00 (2013.01 - EP US); B22F 2999/00 (2013.01 - EP US); C04B 2235/3296 (2013.01 - EP US); C04B 2235/404 (2013.01 - EP US); C04B 2235/6021 (2013.01 - EP US); C04B 2235/604 (2013.01 - EP US); C04B 2235/658 (2013.01 - EP US); C04B 2235/6582 (2013.01 - EP US); C04B 2235/6588 (2013.01 - EP US); C04B 2235/666 (2013.01 - EP US)

Citation (search report)

See references of WO 2011012548A2

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

US 2011020164 A1 20110127; CA 2768979 A1 20110203; EP 2459762 A2 20120606; US 2014353880 A1 20141204; WO 2011012548 A2 20110203; WO 2011012548 A3 20110526

DOCDB simple family (application)

US 84323310 A 20100726; CA 2768979 A 20100723; EP 10742116 A 20100723; EP 2010060713 W 20100723; US 201414463694 A 20140820