EP 2460179 A2 20120606 - LIGHT-UP PREVENTION IN ELECTROSTATIC CHUCKS
Title (en)
LIGHT-UP PREVENTION IN ELECTROSTATIC CHUCKS
Title (de)
ENTZÜNDUNGSSCHUTZ IN ELEKTROSTATISCHEN CHUCKS
Title (fr)
PRÉVENTION D ALLUMAGE DANS DES MANDRINS ÉLECTROSTATIQUES
Publication
Application
Priority
- US 51252009 A 20090730
- US 2010040284 W 20100629
Abstract (en)
[origin: US2011024049A1] An electrostatic chuck assembly is provided comprising a ceramic contact layer, a patterned bonding layer, an electrically conductive base plate, and a subterranean arc mitigation layer. The ceramic contact layer and the electrically conductive base plate cooperate to define a plurality of hybrid gas distribution channels formed in a subterranean portion of the electrostatic chuck assembly. Individual ones of the hybrid gas distribution channels comprise surfaces of relatively high electrical conductivity presented by the electrically conductive base plate and relatively low electrical conductivity presented by the ceramic contact layer. The subterranean arc mitigation layer comprises a layer of relatively low electrical conductivity and is formed over the relatively high conductivity surfaces of the hybrid gas distribution channels in the subterranean portion of the electrostatic chuck assembly. Semiconductor wafer processing chambers are also provided.
IPC 8 full level
B23Q 3/15 (2006.01); C23C 16/458 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H02N 13/00 (2006.01)
CPC (source: EP KR US)
B23Q 3/15 (2013.01 - KR); H01J 37/32541 (2013.01 - EP US); H01J 37/3255 (2013.01 - EP US); H01L 21/67109 (2013.01 - EP US); H01L 21/683 (2013.01 - KR); H01L 21/6831 (2013.01 - EP US); H01L 21/6833 (2013.01 - EP US); H01L 21/6875 (2013.01 - EP US); H01L 21/68757 (2013.01 - EP US); H02N 13/00 (2013.01 - KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
US 2011024049 A1 20110203; CN 102473672 A 20120523; EP 2460179 A2 20120606; EP 2460179 A4 20120606; JP 2013500605 A 20130107; KR 20120048578 A 20120515; SG 10201404264R A 20141030; SG 177584 A1 20120228; TW 201118979 A 20110601; WO 2011014328 A2 20110203; WO 2011014328 A3 20110505
DOCDB simple family (application)
US 51252009 A 20090730; CN 201080032793 A 20100629; EP 10804865 A 20100629; JP 2012522844 A 20100629; KR 20127002270 A 20100629; SG 10201404264R A 20100629; SG 2012001616 A 20100629; TW 99124694 A 20100727; US 2010040284 W 20100629