EP 2467837 A4 20130417 - DOCUMENT PHOTOSENSOR OF SURFACE-MOUNTED ELEMENTS
Title (en)
DOCUMENT PHOTOSENSOR OF SURFACE-MOUNTED ELEMENTS
Title (de)
DOKUMENTEN-FOTOSENSOR FÜR OBERFLÄCHENMONTIERTE ELEMENTE
Title (fr)
CAPTEUR OPTIQUE DE DOCUMENT AVEC DES ÉLÉMENTS MONTÉS EN SURFACE
Publication
Application
Priority
- JP 2009190537 A 20090819
- JP 2010005130 W 20100819
Abstract (en)
[origin: US2011043871A1] A document photosensor is provided which comprises upper and lower sensor assemblies 1 and 2 disposed on opposite sides of a passageway 55 along which a document 50 is transported. Upper sensor assembly 1 comprises an upper substrate 11, an upper LED chip 21 surface-mounted on upper substrate 11 and an upper PD chip 37 surface-mounted on upper substrate 11. Lower sensor assembly 2 comprises a lower substrate 12, a lower LED chip 31 surface-mounted on lower substrate 12 and a lower PD chip 38 surface-mounted on lower substrate 12. These chips 21, 37, 31 and 38 are secured at precise locations on upper and lower substrates 11 and 12 with accuracy on the order of a few micrometers or less to exactly detect by upper and lower PD chips 37, 38 lights irradiated from upper and lower LED chips 21 and 31 after penetration of these lights through particular points on a bill 50 moved along passageway 55 to improve validation performance of bill 50.
IPC 8 full level
G07D 7/12 (2006.01); H04N 1/028 (2006.01); H04N 1/031 (2006.01); H04N 1/12 (2006.01); H04N 1/203 (2006.01)
CPC (source: CN EP US)
G01J 1/42 (2013.01 - US); G07D 7/121 (2013.01 - CN EP US); H04N 1/00724 (2013.01 - CN EP US); H04N 1/00726 (2013.01 - CN EP US); H04N 1/00734 (2013.01 - CN EP US); H04N 1/028 (2013.01 - US); H04N 1/0284 (2013.01 - CN EP US); H04N 1/12 (2013.01 - CN EP US); H04N 1/1215 (2013.01 - CN EP US); H04N 1/203 (2013.01 - CN EP US); H04N 1/2034 (2013.01 - CN EP US); H04N 2201/0418 (2013.01 - CN EP US)
Citation (search report)
- [XY] EP 1482456 A2 20041201 - LAUREL PREC MACHINES CO LTD [JP]
- [YA] EP 1239423 A2 20020911 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [A] EP 1128337 A1 20010829 - GIESECKE & DEVRIENT GMBH [DE]
- See references of WO 2011021395A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
US 2011043871 A1 20110224; US 8400687 B2 20130319; BR 112012003593 A2 20160412; BR 112012003593 B1 20200310; CA 2769848 A1 20110224; CA 2769848 C 20150217; CN 102576478 A 20120711; CN 102576478 B 20150422; CN 104410765 A 20150311; CN 104410765 B 20180109; EP 2467837 A1 20120627; EP 2467837 A4 20130417; EP 2467837 B1 20171122; EP 2908293 A2 20150819; EP 2908293 A3 20150909; EP 2908293 B1 20180502; JP 2011043926 A 20110303; JP 5614957 B2 20141029; RU 2488169 C1 20130720; TW 201140503 A 20111116; TW 201351349 A 20131216; TW I415033 B 20131111; TW I503793 B 20151011; US 2013148173 A1 20130613; US 2013214182 A1 20130822; US 8649069 B2 20140211; US 8730533 B2 20140520; WO 2011021395 A1 20110224; ZA 201202008 B 20121128
DOCDB simple family (application)
US 85938310 A 20100819; BR 112012003593 A 20100819; CA 2769848 A 20100819; CN 201080036440 A 20100819; CN 201410546644 A 20100819; EP 10809741 A 20100819; EP 14003745 A 20100819; JP 2009190537 A 20090819; JP 2010005130 W 20100819; RU 2012110213 A 20100819; TW 102131056 A 20100819; TW 99127737 A 20100819; US 201313761946 A 20130207; US 201313782614 A 20130301; ZA 201202008 A 20120316