EP 2471180 A4 20130828 - DIE LOCATION COMPENSATION
Title (en)
DIE LOCATION COMPENSATION
Title (de)
STANZENPOSITIONSAUSGLEICH
Title (fr)
COMPENSATION DE L'EMPLACEMENT D'UNE PUCE
Publication
Application
Priority
- US 54888309 A 20090827
- US 2010044123 W 20100802
Abstract (en)
[origin: US2011050303A1] Embodiments are described that compensate for a difference in a characteristic (e.g., of performance or operation) of a semiconductor device that is a function of the location of a die in a device. In one embodiment, a clock circuit may generate a clock signal having a timing that varies with the location of a die so that signals are coupled from the die to a substrate at the same time despite differences in the signal propagation time between the substrate and the various die. In other embodiments, for example, differences in the termination impedance or driver drive-strength resulting from differences in the location of a die in a stack may be compensated for. Other embodiments are also disclosed.
IPC 8 full level
H03L 7/081 (2006.01); G11C 5/02 (2006.01); G11C 11/407 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H03K 5/14 (2006.01)
CPC (source: EP KR US)
G11C 5/02 (2013.01 - EP US); G11C 7/222 (2013.01 - EP US); G11C 11/407 (2013.01 - KR); G11C 29/023 (2013.01 - EP US); G11C 29/025 (2013.01 - EP US); G11C 29/028 (2013.01 - EP US); H01L 23/12 (2013.01 - KR); H03K 5/14 (2013.01 - KR); H03L 7/081 (2013.01 - KR); H03L 7/0814 (2013.01 - EP US); H03L 7/0816 (2013.01 - EP US); H01L 2224/14181 (2013.01 - EP US); H01L 2224/16145 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/73207 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US)
Citation (search report)
- [XI] US 2008043548 A1 20080221 - JUNG WON-CHANG [KR], et al
- [A] US 2009154285 A1 20090618 - PYEON HONG BEOM [CA]
- [A] US 2008204091 A1 20080828 - CHOO CHUL-HWAN [KR], et al
- See references of WO 2011028348A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
US 2011050303 A1 20110303; US 9160349 B2 20151013; CN 102484477 A 20120530; CN 102484477 B 20150624; EP 2471180 A2 20120704; EP 2471180 A4 20130828; EP 2471180 B1 20201007; KR 101443463 B1 20140923; KR 20120056268 A 20120601; TW 201130230 A 20110901; TW I459722 B 20141101; US 10063241 B2 20180828; US 2015381189 A1 20151231; WO 2011028348 A2 20110310; WO 2011028348 A3 20110428
DOCDB simple family (application)
US 54888309 A 20090827; CN 201080037704 A 20100802; EP 10814131 A 20100802; KR 20127006055 A 20100802; TW 99128113 A 20100823; US 2010044123 W 20100802; US 201514843676 A 20150902