EP 2473253 A2 20120711 - METHOD FOR POTTING CERAMIC CAPILLARY MEMBRANES
Title (en)
METHOD FOR POTTING CERAMIC CAPILLARY MEMBRANES
Title (de)
VERFAHREN ZUR POTTUNG KERAMISCHER KAPILLARMEMBRANEN
Title (fr)
PROCÉDÉ D'ENROBAGE DE MEMBRANES CAPILLAIRES CÉRAMIQUES
Publication
Application
Priority
- DE 102009038814 A 20090831
- EP 2010005193 W 20100825
Abstract (en)
[origin: WO2011023371A2] The invention relates to a module element comprising a high-temperature resistant base, said high-temperature resistant base having at least one metal or ceramic bottom that has at least one through-passage for introducing a ceramic capillary membrane, and at least one potting that is formed as a sufficiently gas-tight and high-temperature resistant connection between the metal or ceramic bottom and the at least one ceramic capillary membrane. The at least one through-opening of the at least one metal or ceramic bottom has an enlarged portion on at least one side of the metal or ceramic bottom for accommodating the sufficiently gas-tight and high-temperature resistant connection.
IPC 8 full level
B01D 53/22 (2006.01); B01D 63/02 (2006.01); B01D 71/02 (2006.01); B01J 19/24 (2006.01); B29C 70/74 (2006.01); C01B 13/02 (2006.01); C04B 37/00 (2006.01); C04B 37/04 (2006.01)
CPC (source: EP US)
B01D 53/22 (2013.01 - EP US); B01D 63/0221 (2022.08 - EP US); B01D 63/023 (2013.01 - EP US); B01D 71/0271 (2022.08 - EP US); B01J 19/2475 (2013.01 - EP US); C01B 13/0255 (2013.01 - EP US); C03C 8/04 (2013.01 - EP US); C03C 8/06 (2013.01 - EP US); C03C 8/24 (2013.01 - EP US); C04B 37/005 (2013.01 - EP US); C04B 37/025 (2013.01 - EP US); C04B 37/045 (2013.01 - EP US); C01B 2210/0046 (2013.01 - EP US); C04B 2235/656 (2013.01 - EP US); C04B 2235/6562 (2013.01 - EP US); C04B 2235/6584 (2013.01 - EP US); C04B 2237/10 (2013.01 - EP US); C04B 2237/54 (2013.01 - EP US)
Citation (search report)
See references of WO 2011023371A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2011023371 A2 20110303; WO 2011023371 A3 20110603; WO 2011023371 A4 20110721; DE 102009038814 A1 20110310; EP 2473253 A2 20120711; JP 2013503028 A 20130131; US 2013042763 A1 20130221; US 8840711 B2 20140923
DOCDB simple family (application)
EP 2010005193 W 20100825; DE 102009038814 A 20090831; EP 10805415 A 20100825; JP 2012525924 A 20100825; US 201013393444 A 20100825