EP 2478126 A1 20120725 - METHOD FOR REACTIVE SPUTTERING
Title (en)
METHOD FOR REACTIVE SPUTTERING
Title (de)
REAKTIVES SPUTTERVERFAHREN
Title (fr)
PROCÉDÉ DE PULVÉRISATION CATHODIQUE RÉACTIVE
Publication
Application
Priority
- CZ 2009504 A 20090728
- CZ 2010000082 W 20100727
Abstract (en)
[origin: WO2011012093A1] The invention is related to the method of creating protective and functional layers using the PVD method, from a cathode with reduced surface electrical conductivity, by way of application from the working coating source where the principle is that the material is applied to the substrate (6) from the working coating source designed as a rotating working cathode (2) wherein the rotating working cathode (2) is coated during the process from the auxiliary coating source with material with sufficient electrical conductivity where the layer of the coating applied to the surface of the rotating working cathode (2) has greater electrical conductivity than the surface of this rotating working cathode (2) created during the processes without coating of the rotating working cathode using the auxiliary coating source.
IPC 8 full level
C23C 14/00 (2006.01); C23C 14/08 (2006.01); C23C 14/35 (2006.01); C23C 14/36 (2006.01)
CPC (source: EP)
C23C 14/0036 (2013.01); C23C 14/0068 (2013.01); C23C 14/08 (2013.01)
Citation (search report)
See references of WO 2011012093A1
Citation (examination)
US 2002092766 A1 20020718 - LAMPKIN CURTIS M [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2011012093 A1 20110203; CZ 2009504 A3 20110209; CZ 305038 B6 20150408; EP 2478126 A1 20120725
DOCDB simple family (application)
CZ 2010000082 W 20100727; CZ 2009504 A 20090728; EP 10763585 A 20100727