EP 2484787 A4 20130605 - Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME
Title (en)
Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME
Title (de)
KUPFERLEGIERUNG AUF CU-NI-SI-CO-BASIS FÜR EIN ELEKTRONISCHES MATERIAL UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
ALLIAGE CU-NI-SI-CO POUR MATÉRIEL ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION
Publication
Application
Priority
JP 2009066794 W 20090928
Abstract (en)
[origin: EP2484787A1] A Cu-Ni-Si-Co alloy which has mechanical and electrical properties that render the alloy suitable for use as a copper alloy for electronic materials and which has even mechanical properties. The copper alloy for electronic materials contains 1.0-2.5 mass% nickel, 0.5-2.5 mass% cobalt, and 0.3-1.2 mass% silicon, with the remainder being copper and incidental impurities, and has an average crystal-grain diameter of 15-30 [mu]m, the average of differences between maximum crystal-grain diameter and minimum crystal-grain diameter for respective fields of view each having an area of 0.5 mm2 being 10 [mu]m or smaller.
IPC 8 full level
C22C 9/06 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP KR)
C22C 9/00 (2013.01 - KR); C22C 9/06 (2013.01 - EP KR); C22F 1/08 (2013.01 - EP KR)
Citation (search report)
- [XA] US 2008190524 A1 20080814 - GAO WEILIN [JP], et al
- [A] JP 2008266783 A 20081106 - FURUKAWA ELECTRIC CO LTD
- [A] EP 1876250 A1 20080109 - NIPPON MINING CO [JP]
- [XA] WO 2009082695 A1 20090702 - GBC METALS LLC [US], et al
- [A] US 2004079456 A1 20040429 - MANDIGO FRANK N [US], et al
- [A] JP 2009007666 A 20090115 - FURUKAWA ELECTRIC CO LTD
- [A] JP 2008106356 A 20080508 - DOWA METALTECH KK
- [A] H.-A. KUHN ET AL: "A new high performance copper based alloy for electro-mechanical connectors", MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, vol. 38, no. 8, 1 August 2007 (2007-08-01), pages 624 - 634, XP055060686, ISSN: 0933-5137, DOI: 10.1002/mawe.200700152
- See references of WO 2011036804A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2484787 A1 20120808; EP 2484787 A4 20130605; EP 2484787 B1 20150107; CN 102549180 A 20120704; JP 5506806 B2 20140528; JP WO2011036804 A1 20130214; KR 20120054099 A 20120529; WO 2011036804 A1 20110331
DOCDB simple family (application)
EP 09849834 A 20090928; CN 200980161688 A 20090928; JP 2009066794 W 20090928; JP 2011532878 A 20090928; KR 20127009709 A 20090928