Global Patent Index - EP 2485841 A1

EP 2485841 A1 20120815 - JOINING METHOD FOR MICROFLUIDIC COMPONENTS

Title (en)

JOINING METHOD FOR MICROFLUIDIC COMPONENTS

Title (de)

FÜGEVERFAHREN FÜR MIKROFLUIDISCHE BAUTEILE

Title (fr)

PROCÉDÉ D'ASSEMBLAGE POUR COMPOSANTS MICROFLUIDIQUES

Publication

EP 2485841 A1 20120815 (DE)

Application

EP 10760703 A 20101005

Priority

  • EP 09012564 A 20091005
  • EP 2010064808 W 20101005
  • EP 10760703 A 20101005

Abstract (en)

[origin: WO2011042422A1] The invention relates to joining plastic components into a microfluidic cartridge (20). The invention in particular relates to cartridges (20) for diagnostic analysis devices. The cartridge (20) comprises a fluidically conductive floor element (11), a cover (2), and a film (3) disposed between the elements (1, 2). The cover (2) or the floor element (1) and the film (3) comprise a filling opening (5) for filling microfluidic channels (4) in one of the elements having sample fluid. Pins (6) formed integrally with one of the board-shaped elements (1, 2) engage in corresponding holes (7) in the film (3) and the associated element (1, 2) for each. By means of deforming a pin (6), a friction fit is produced between a deformed pin and the wall of a hole, and a head (9) contacting the associated substrate in a form-fitting manner is formed. For the joining process, a press tool (12) is placed on a head end (9) of a pin (6) at a predetermined pressure P, and heat transfer into the pin (6) takes place during a weld time ts. The pin material is brought to above the glass transition temperature and/or the melting point, and a friction fit between the pin (6) and the wall of the hole (7) is formed by flowing the pin material in the hole (7).

IPC 8 full level

B01L 3/00 (2006.01); B29C 65/60 (2006.01); B81C 3/00 (2006.01)

CPC (source: EP US)

B01L 3/502707 (2013.01 - EP US); B29C 65/606 (2013.01 - EP US); B29C 65/8215 (2013.01 - EP US); B29C 66/12461 (2013.01 - EP); B29C 66/24221 (2013.01 - EP); B29C 66/5412 (2013.01 - EP US); B29C 66/542 (2013.01 - EP US); B29C 66/81422 (2013.01 - EP US); B29C 66/8322 (2013.01 - EP US); B29C 66/91411 (2013.01 - EP US); B29C 66/91921 (2013.01 - EP US); B29C 66/91943 (2013.01 - EP US); B29C 66/929 (2013.01 - EP US); B29C 66/949 (2013.01 - EP US); B81C 3/001 (2013.01 - EP US); B01L 2200/025 (2013.01 - EP US); B01L 2200/0689 (2013.01 - EP US); B01L 2300/0816 (2013.01 - EP US); B01L 2300/0887 (2013.01 - EP US); B29C 65/08 (2013.01 - EP US); B29C 65/8207 (2013.01 - EP US); B29C 66/71 (2013.01 - EP US); B29C 66/81417 (2013.01 - EP US); B29C 66/91421 (2013.01 - EP US); B29C 66/919 (2013.01 - EP US); B29C 66/91933 (2013.01 - EP US); B29K 2023/06 (2013.01 - EP US); B29K 2023/12 (2013.01 - EP US); B29K 2025/00 (2013.01 - EP US); B29K 2033/12 (2013.01 - EP US); B29K 2069/00 (2013.01 - EP US); B29K 2071/00 (2013.01 - EP US); B29L 2031/756 (2013.01 - EP US); B81B 2201/058 (2013.01 - EP US); B81C 2203/032 (2013.01 - EP US); B81C 2203/051 (2013.01 - EP US)

Citation (search report)

See references of WO 2011042422A1

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2011042422 A1 20110414; EP 2485841 A1 20120815; JP 2013506855 A 20130228; US 2012275972 A1 20121101; US 9333707 B2 20160510

DOCDB simple family (application)

EP 2010064808 W 20101005; EP 10760703 A 20101005; JP 2012532567 A 20101005; US 201013500139 A 20101005