Global Patent Index - EP 2491620 A1

EP 2491620 A1 20120829 - SOLDERLESS ELECTRICAL CONNECTION

Title (en)

SOLDERLESS ELECTRICAL CONNECTION

Title (de)

LÖTFREIE ELEKTRISCHE VERBINDUNG

Title (fr)

CONNEXION ÉLECTRIQUE SANS SOUDURE

Publication

EP 2491620 A1 20120829 (DE)

Application

EP 10771044 A 20101004

Priority

  • DE 102009045806 A 20091019
  • DE 102009047043 A 20091124
  • EP 2010064726 W 20101004

Abstract (en)

[origin: WO2011047953A1] The invention relates to a solderless electrical connection (42) between a first joining partner (10, 46) and a second joining partner (24, 26; 44) for connecting an electrical component, a connector strip or a lead frame. According to the invention, the first joining partner (10, 46) or both joining partners (10, 46, 24, 26, 44) have an OSP coating (56) on their respective contact surfaces (14, 48, 54, 34, 50).

IPC 8 full level

H01R 4/58 (2006.01)

CPC (source: EP US)

C23C 18/1653 (2013.01 - EP); C25D 5/10 (2013.01 - EP US); C25D 5/48 (2013.01 - EP); H01R 4/26 (2013.01 - EP US); H01R 4/58 (2013.01 - EP US); H01R 13/03 (2013.01 - EP US); H01R 4/2416 (2013.01 - EP US); H01R 12/585 (2013.01 - EP US)

Citation (search report)

See references of WO 2011047953A1

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102009047043 A1 20110421; CN 102668247 A 20120912; CN 102668247 B 20150610; EP 2491620 A1 20120829; IN 433DEN2012 A 20150515; JP 2013508902 A 20130307; JP 5599466 B2 20141001; US 2012270432 A1 20121025; US 8932090 B2 20150113; WO 2011047953 A1 20110428

DOCDB simple family (application)

DE 102009047043 A 20091124; CN 201080047001 A 20101004; EP 10771044 A 20101004; EP 2010064726 W 20101004; IN 433DEN2012 A 20120116; JP 2012534611 A 20101004; US 201013502795 A 20101004