Global Patent Index - EP 2491771 A1

EP 2491771 A1 20120829 - COUPLING DEVICE, ASSEMBLY HAVING A COUPLING DEVICE, AND METHOD FOR PRODUCING AN ASSEMBLY HAVING A COUPLING DEVICE

Title (en)

COUPLING DEVICE, ASSEMBLY HAVING A COUPLING DEVICE, AND METHOD FOR PRODUCING AN ASSEMBLY HAVING A COUPLING DEVICE

Title (de)

KOPPELVORRICHTUNG, ANORDNUNG MIT EINER KOPPELVORRICHTUNG, VERFAHREN ZUR HERSTELLUNG EINER ANORDNUNG MIT EINER KOPPELVORRICHTUNG

Title (fr)

DISPOSITIF DE COUPLAGE, SYSTÈME COMPORTANT UN DISPOSITIF DE COUPLAGE, PROCÉDÉ DE FABRICATION D'UN SYSTÈME COMPORTANT UN DISPOSITIF DE COUPLAGE

Publication

EP 2491771 A1 20120829 (DE)

Application

EP 10771047 A 20101005

Priority

  • DE 102009045911 A 20091022
  • EP 2010064806 W 20101005

Abstract (en)

[origin: WO2011047955A1] The invention relates to a method for a coupling device (1) for connecting an electrical/electronic component (16), in particular a sensor (17), having a substrate, in particular a circuit board, wherein the coupling device (1) comprises at least one electrical connection (25) for electrical contacting and at least one damper element (12) for movement uncoupling, wherein the electrical connection is formed by a lead frame (3) and the lead frame (3) is overmolded in regions by a damping mass (11) as a damper element (12). The invention furthermore relates to an assembly having a coupling device and a method for producing said type of assembly.

IPC 8 full level

H05K 1/02 (2006.01); B29C 45/14 (2006.01); H05K 3/20 (2006.01)

CPC (source: EP KR US)

B29C 45/14 (2013.01 - KR); H05K 1/0271 (2013.01 - EP KR US); H05K 3/20 (2013.01 - KR); H05K 3/4084 (2013.01 - EP US); B29C 45/14 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 3/202 (2013.01 - EP US); H05K 2201/0133 (2013.01 - EP US); H05K 2201/09118 (2013.01 - EP US); H05K 2201/10151 (2013.01 - EP US); H05K 2201/10378 (2013.01 - EP US); Y10T 29/49146 (2015.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 2011047955A1

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102009045911 A1 20110428; CN 102577636 A 20120711; CN 102577636 B 20160120; EP 2491771 A1 20120829; JP 2013508959 A 20130307; JP 5372259 B2 20131218; KR 101811998 B1 20171226; KR 20120100940 A 20120912; TW 201132259 A 20110916; US 2012267153 A1 20121025; WO 2011047955 A1 20110428

DOCDB simple family (application)

DE 102009045911 A 20091022; CN 201080047705 A 20101005; EP 10771047 A 20101005; EP 2010064806 W 20101005; JP 2012534613 A 20101005; KR 20127010265 A 20101005; TW 99135665 A 20101020; US 201013503581 A 20101005