Global Patent Index - EP 2498288 A3

EP 2498288 A3 20140423 - Circuit board using heat radiating member, electronic module and method for manufacturing the module

Title (en)

Circuit board using heat radiating member, electronic module and method for manufacturing the module

Title (de)

Leiterplatte mit Kühlkörper, elektronisches Modul und Verfahren zur Herstellung des Moduls

Title (fr)

Carte de circuit imprimé avec dissipateur thermique, module électronique et procédé de fabrication du module

Publication

EP 2498288 A3 20140423 (EN)

Application

EP 12171052 A 20080311

Priority

  • EP 08721792 A 20080311
  • JP 2007062033 A 20070312

Abstract (en)

[origin: EP2136400A1] It is intended to provide a circuit board using a heat radiating member that can cool an electronic component sufficiently without causing a substrate to break, increasing the total weight of the substrate, lowering the productivity, or increasing cost and device size. A circuit board has a substrate main body (4) having a wiring pattern (3) formed on a surface side, and a structure in which an LED module (1) is connected to the wiring pattern (3). The circuit board is characterized in that : a through hole (6) is provided in a portion of the substrate main body (4) so as to penetrate the substrate main body (4) from the surface side to a back side thereof; a heat radiating member (5) is provided on the back side of the substrate main body (4) so as to close one end of the through hole (6); and the LED module (1) is disposed in the through hole (6) so that the heat radiating member (5) and the LED module (1) are directly in contact with each other.

IPC 8 full level

H01L 23/373 (2006.01); H05K 1/02 (2006.01)

CPC (source: EP KR US)

H01L 23/12 (2013.01 - KR); H01L 23/373 (2013.01 - EP KR US); H05K 1/02 (2013.01 - KR); H05K 1/021 (2013.01 - EP US); H01L 23/13 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 33/641 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01012 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/15153 (2013.01 - EP US); H01L 2924/1517 (2013.01 - EP US); H05K 1/182 (2013.01 - EP US); H05K 3/0058 (2013.01 - EP US); H05K 2201/0323 (2013.01 - EP US); H05K 2201/10106 (2013.01 - EP US); Y10T 29/4913 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2136400 A1 20091223; EP 2136400 A4 20111221; CN 101632171 A 20100120; EP 2498288 A2 20120912; EP 2498288 A3 20140423; JP WO2008126564 A1 20100722; KR 20090122180 A 20091126; TW 200901867 A 20090101; US 2010157612 A1 20100624; WO 2008126564 A1 20081023

DOCDB simple family (application)

EP 08721792 A 20080311; CN 200880008094 A 20080311; EP 12171052 A 20080311; JP 2008054376 W 20080311; JP 2009508992 A 20080311; KR 20097013642 A 20080311; TW 97108726 A 20080312; US 53128609 A 20090311