EP 2500940 A1 20120919 - Systems including an I/O stack and methods for fabricating such systems
Title (en)
Systems including an I/O stack and methods for fabricating such systems
Title (de)
Systeme mit einem E/A-Stapel und Verfahren zur Herstellung solcher Systeme
Title (fr)
Systèmes comprenant un empilement d'E/S et procédés de fabrication de tels systèmes
Publication
Application
Priority
US 201113046247 A 20110311
Abstract (en)
Systems including an input/output (I/O) stack and methods for fabricating such systems are described. In one implementation, the methods include stacking an I/O die including I/O elements and excluding a logic element. Also in one implementation, the methods further include stacking an integrated circuit die with respect to the I/O die. The integrated circuit includes logic elements and excludes an I/O element. The separation of the I/O die from the integrated circuit die provides various benefits, such as independent development of each of the dies and more space for the I/O elements on an I/O substrate of the I/O die compared to that in a conventional die. The increase in space allows new process generation of the integrated circuit die in which an increasing number of logic elements are fitted within the same surface area of a substrate of the integrated circuit die.
IPC 8 full level
G01R 1/36 (2006.01); H01L 23/60 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
H01L 24/73 (2013.01 - EP US); H01L 25/0657 (2013.01 - EP US); H01L 25/18 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/16235 (2013.01 - EP US); H01L 2224/16238 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/73207 (2013.01 - EP US); H01L 2224/73253 (2013.01 - EP US); H01L 2224/73257 (2013.01 - EP US); H01L 2225/0651 (2013.01 - EP US); H01L 2225/06513 (2013.01 - EP US); H01L 2225/06541 (2013.01 - EP US); H01L 2225/06562 (2013.01 - EP US); H01L 2225/06572 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01076 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19107 (2013.01 - EP US)
Citation (search report)
- [XI] US 7808075 B1 20101005 - CHENG CHUAN-CHENG [US], et al
- [A] US 2010148344 A1 20100617 - CHANDRA HARRY [US], et al
- [A] EP 1255202 A2 20021106 - MEGIC CORP [TW]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2500940 A1 20120919; CN 102684681 A 20120919; CN 102684681 B 20160803; JP 2012191213 A 20121004; JP 5969224 B2 20160817; US 2012228760 A1 20120913; US 8786080 B2 20140722
DOCDB simple family (application)
EP 12158947 A 20120309; CN 201210132555 A 20120309; JP 2012053203 A 20120309; US 201113046247 A 20110311