EP 2504668 A2 20121003 - SENSOR MODULE, PRODUCTION METHOD OF A SENSOR MODULE, AND INJECTION MOLD FOR ENCAPSULATING A SENSOR MODULE
Title (en)
SENSOR MODULE, PRODUCTION METHOD OF A SENSOR MODULE, AND INJECTION MOLD FOR ENCAPSULATING A SENSOR MODULE
Title (de)
SENSORMODUL, HERSTELLUNGSVERFAHREN EINES SENSORMODULS SOWIE SPRITZGIESSWERKZEUG ZUM UMGIESSEN EINES SENSORMODULS
Title (fr)
MODULE DÉTECTEUR, PROCÉDÉ DE PRODUCTION D'UN MODULE DÉTECTEUR ET MOULE DE COULÉE SOUS PRESSION POUR ENCAPSULER UN MODULE DÉTECTEUR
Publication
Application
Priority
- DE 102009055718 A 20091126
- EP 2010068340 W 20101126
Abstract (en)
[origin: WO2011064347A2] The invention relates to a sensor module comprising a chip carrier and a sensor chip disposed thereon. A channel is formed between the chip carrier and the sensor chip, by means of which a medium can be fed to the sensor chip. The invention further relates to an injection mold for covering the sensor module, and to a production method for a covered sensor module.
IPC 8 full level
G01D 11/24 (2006.01)
CPC (source: EP US)
G01D 11/245 (2013.01 - EP US); G01L 19/0038 (2013.01 - EP US); G01L 19/141 (2013.01 - EP US); G01L 19/148 (2013.01 - EP US); H01L 21/56 (2013.01 - US); H01L 23/28 (2013.01 - US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 2011064347A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102009055718 A1 20110601; EP 2504668 A2 20121003; US 2013187295 A1 20130725; WO 2011064347 A2 20110603; WO 2011064347 A3 20110721
DOCDB simple family (application)
DE 102009055718 A 20091126; EP 10790367 A 20101126; EP 2010068340 W 20101126; US 201013512295 A 20101126