EP 2510542 A1 20121017 - IGBT COOLING METHOD
Title (en)
IGBT COOLING METHOD
Title (de)
IGBT-KÜHLVERFAHREN
Title (fr)
PROCÉDÉ DE REFROIDISSEMENT D'IGBT
Publication
Application
Priority
- US 65323709 A 20091210
- US 2010000689 W 20100308
Abstract (en)
[origin: US2010147492A1] A method for cooling power electronic devices such as IGBT's. The method comprises placing the IGBT board in a containment structure and flooding the containment with circulating liquid refrigerant. The liquid refrigerant is boiled within the containment and the resulting gas is then removed for continued circulation within a heat engine. The phase change of the refrigerant provides excellent cooling properties. In addition, the ability to place the cooling medium directly over the IGBT's themselves represents a significant advantage.
IPC 8 full level
F28D 15/02 (2006.01); F28D 15/06 (2006.01); H01L 23/427 (2006.01); H01L 23/44 (2006.01); H01L 23/473 (2006.01)
CPC (source: EP US)
F28D 15/0266 (2013.01 - EP US); F28D 15/06 (2013.01 - EP US); H01L 23/427 (2013.01 - EP US); H01L 23/44 (2013.01 - EP US); H01L 23/4735 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
US 2010147492 A1 20100617; AU 2010328687 A1 20120621; CN 102714193 A 20121003; EP 2510542 A1 20121017; EP 2510542 A4 20150311; IN 3321DEN2012 A 20151023; WO 2011071508 A1 20110616
DOCDB simple family (application)
US 65323709 A 20091210; AU 2010328687 A 20100308; CN 201080054140 A 20100308; EP 10836298 A 20100308; IN 3321DEN2012 A 20120417; US 2010000689 W 20100308