EP 2513243 A2 20121024 - CRIMPING FOLD BOND
Title (en)
CRIMPING FOLD BOND
Title (de)
BÖRDELFALZVERKLEBUNG
Title (fr)
COLLAGE DE REPLI DE BORDAGE
Publication
Application
Priority
- EP 09179931 A 20091218
- EP 2010070147 W 20101217
- EP 10795366 A 20101217
Abstract (en)
[origin: EP2336262A1] Use of a heat curing epoxide composition comprising at least one epoxy resin A with an average more than one epoxide group per molecule; at least one curing agent for epoxy resin B, which is activated by an increased temperature; and metallic particles (5) with an average particle size of 50-3000 mu m as a crimping fold adhesive, is claimed. Independent claims are also included for: (1) producing the crimping fold adhesive, comprising (a) applying the heat curing epoxide composition to an inner panel (3) or to an outer panel (2), (b) contacting the heat curing epoxide composition (4) with the outer panel or the inner panel, (c) crimping the outer panel to the inner panel, so that the interior space of the crimping fold is provided with the heat curing epoxide composition, (d) pressing the crimping fold, and (e) introducing thermal energy into the heat curing epoxide composition; and (2) the crimping fold adhesive by the above mentioned method.
IPC 8 full level
C09J 163/00 (2006.01); B62D 27/02 (2006.01); C09J 5/06 (2006.01); F16J 15/14 (2006.01)
CPC (source: EP)
B62D 27/026 (2013.01); C09J 5/06 (2013.01); C09J 163/00 (2013.01); F16J 15/14 (2013.01); C08K 3/10 (2013.01); C08L 75/04 (2013.01); C08L 2666/20 (2013.01); C08L 2666/54 (2013.01); C09J 2463/00 (2013.01)
Citation (search report)
See references of WO 2011073422A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2336262 A1 20110622; EP 2513243 A2 20121024; WO 2011073422 A2 20110623; WO 2011073422 A3 20110811
DOCDB simple family (application)
EP 09179931 A 20091218; EP 10795366 A 20101217; EP 2010070147 W 20101217