EP 2513957 A2 20121024 - METHOD FOR PRODUCING AN ELECTRONIC UNIT AND ELECTRONIC UNIT
Title (en)
METHOD FOR PRODUCING AN ELECTRONIC UNIT AND ELECTRONIC UNIT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN BAUGRUPPE UND ELEKTRONISCHE BAUGRUPPE
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MODULE ÉLECTRONIQUE, AINSI QUE MODULE ÉLECTRONIQUE
Publication
Application
Priority
- DE 102009058764 A 20091215
- EP 2010007628 W 20101214
Abstract (en)
[origin: WO2011082778A2] The invention relates to a method for producing an electronic unit, wherein at least one electronic component is at least partially embedded in an insulating material, comprising the following steps: providing a film assembly with at least one conductive layer and a carrier layer, or with only a conductive layer, structuring the conductive layer such that openings in form of blind holes or through holes for receiving bumps are produced, which are connected to the contact surfaces of the at least one electronic component, applying an adhesive layer to the conductive layer provided with openings, placing the at least one component on the film assembly, or in the conductive layer, such that the bumps engage with the openings of the conductive layer, partially embedding the at least one component from the side opposite of the bumps (3) into a dielectric layer, removing the carrier layer of the film assembly, or a part of the conductive layer, such that the surface of the bumps is exposed, depositing a metallization layer on the side of the remaining conductive layer having the exposed bumps, and structuring the metallization layer and the conductive layer so as to produce conductor tracks that overlap with the bumps. The invention further relates to an electronic unit produced by such a method.
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
H01L 21/4832 (2013.01 - EP US); H01L 21/56 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H05K 1/188 (2013.01 - EP US); H01L 23/3107 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 24/28 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 2221/68377 (2013.01 - EP US); H01L 2223/54426 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP US); H01L 2224/13144 (2013.01 - EP US); H01L 2224/13147 (2013.01 - EP US); H01L 2224/13155 (2013.01 - EP US); H01L 2224/13164 (2013.01 - EP US); H01L 2224/136 (2013.01 - EP US); H01L 2224/2402 (2013.01 - EP US); H01L 2224/2919 (2013.01 - EP US); H01L 2224/81121 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/838 (2013.01 - EP US); H01L 2224/92 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/0665 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H05K 3/025 (2013.01 - EP US); H05K 2201/0969 (2013.01 - EP US); H05K 2201/09745 (2013.01 - EP US); H05K 2203/0353 (2013.01 - EP US)
Citation (search report)
See references of WO 2011082778A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102009058764 A1 20110616; EP 2513957 A2 20121024; US 2013015572 A1 20130117; US 8975116 B2 20150310; WO 2011082778 A2 20110714; WO 2011082778 A3 20110915
DOCDB simple family (application)
DE 102009058764 A 20091215; EP 10792842 A 20101214; EP 2010007628 W 20101214; US 201013515137 A 20101214