Global Patent Index - EP 2517593 A4

EP 2517593 A4 20131113 - ZIPPER COMPONENT AND SLIDE ZIPPER, AND METHOD FOR PRODUCING ZIPPER COMPONENT

Title (en)

ZIPPER COMPONENT AND SLIDE ZIPPER, AND METHOD FOR PRODUCING ZIPPER COMPONENT

Title (de)

REISSVERSCHLUSSTEIL UND REISSVERSCHLUSS SOWIE VERFAHREN ZUR HERSTELLUNG DES REISSVERSCHLUSSTEILS

Title (fr)

COMPOSANT DE FERMETURE À GLISSIÈRE ET FERMETURE À GLISSIÈRE AVEC CURSEUR, ET PROCÉDÉ DE PRODUCTION D'UN COMPOSANT DE FERMETURE À GLISSIÈRE

Publication

EP 2517593 A4 20131113 (EN)

Application

EP 09852582 A 20091225

Priority

JP 2009071667 W 20091225

Abstract (en)

[origin: EP2517593A1] A zipper component (1) according to the invention includes a metal plating film (3) provided on the surface of a component body (2) made of a metal. Further, in the zipper component (1), at least a part of the component body (2) has been thermally treated before bending and thus the metal plating film (3) has a recrystallized structure wherein at least a part of the metal plating film (3) been recrystallized. Accordingly, since the ductility of the metal plating film (3) can be improved, even when the zipper component (1) is bent, the metal plating film (3) can be deformed to follow the deformation of the component body (2). Therefore, the occurrence of crevicing or cracking in the metal plating film (3) can be prevented.

IPC 8 full level

A44B 19/38 (2006.01); A44B 19/42 (2006.01); B21D 53/56 (2006.01)

CPC (source: EP KR US)

A44B 19/28 (2013.01 - KR); A44B 19/388 (2013.01 - EP US); A44B 19/42 (2013.01 - EP US); B21D 39/02 (2013.01 - EP US); Y10T 24/25 (2015.01 - EP US); Y10T 24/2561 (2015.01 - EP US); Y10T 24/2598 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

EP 2517593 A1 20121031; EP 2517593 A4 20131113; EP 2517593 B1 20151111; CN 102665473 A 20120912; CN 102665473 B 20150422; ES 2557600 T3 20160127; HK 1171345 A1 20130328; JP 5490144 B2 20140514; JP WO2011077567 A1 20130502; KR 101388417 B1 20140422; KR 20120073374 A 20120704; US 2012297583 A1 20121129; WO 2011077567 A1 20110630

DOCDB simple family (application)

EP 09852582 A 20091225; CN 200980162995 A 20091225; ES 09852582 T 20091225; HK 12112121 A 20121126; JP 2009071667 W 20091225; JP 2011547176 A 20091225; KR 20127016265 A 20091225; US 200913518928 A 20091225