EP 2524384 B1 20161130 - ELECTRICAL CONTACT ELEMENT AND METHOD FOR PRODUCING IT
Title (en)
ELECTRICAL CONTACT ELEMENT AND METHOD FOR PRODUCING IT
Title (de)
ELEKTRISCHES KONTAKTELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES ELEKTRISCHEN KONTAKTELEMENTS
Title (fr)
CONTACT ÉLECTRIQUE ET PROCÉDÉ POUR SA FABRICATION
Publication
Application
Priority
- DE 102010014745 A 20100413
- US 29553010 P 20100115
- EP 2011050482 W 20110114
Abstract (en)
[origin: DE102010014745A1] The method involves providing a wire into a cladding, where wire is made of electrical conductive material e.g. copper. A cylindrical semi-finished material is formed by dividing the wire in a direction transverse to a wire longitudinal axis. The semi-finished material is fixed on a contact carrier (104) so that an electrical conductive material or metal coat of the cladding is connected with the carrier. The semi-finished material is reshaped for formation of a contact member (100). A contacting area (106) is accessible for a counter contact, via which the material of the wire is formed. An independent claim is also included for an electrical contact member that is manufactured by the method.
IPC 8 full level
H01H 1/021 (2006.01); H01H 1/0237 (2006.01); H01H 11/06 (2006.01)
CPC (source: EP US)
H01H 1/021 (2013.01 - EP US); H01H 1/023 (2013.01 - EP US); H01H 1/0237 (2013.01 - EP US); H01H 11/06 (2013.01 - EP US); Y10T 29/49204 (2015.01 - US); Y10T 29/54 (2015.01 - US); Y10T 428/24314 (2015.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010014745 A1 20110721; DE 102010014745 B4 20110922; BR 112012017590 A2 20160816; BR 112012017590 B1 20200331; CN 102782787 A 20121114; CN 102782787 B 20160224; EP 2524384 A1 20121121; EP 2524384 B1 20161130; ES 2613615 T3 20170524; JP 2013517594 A 20130516; JP 2015201454 A 20151112; JP 6280524 B2 20180214; US 2013002380 A1 20130103; US 8749330 B2 20140610; WO 2011086167 A1 20110721
DOCDB simple family (application)
DE 102010014745 A 20100413; BR 112012017590 A 20110114; CN 201180005794 A 20110114; EP 11700420 A 20110114; EP 2011050482 W 20110114; ES 11700420 T 20110114; JP 2012548449 A 20110114; JP 2015120999 A 20150616; US 201113521964 A 20110114