Global Patent Index - EP 2524782 A1

EP 2524782 A1 20121121 - Low density multilayer chipboard panel and process for making said panel

Title (en)

Low density multilayer chipboard panel and process for making said panel

Title (de)

Mehrschichtige Spanplatte niedriger Dichte sowie Verfahren zur Herstellung einer Spanplatte

Title (fr)

Panneau aggloméré multicouche à faible densité et procédé de fabrication d'un panneau

Publication

EP 2524782 A1 20121121 (EN)

Application

EP 11425136 A 20110520

Priority

EP 11425136 A 20110520

Abstract (en)

The present invention provides a so-called "ultralight" multilayer chipboard panel (1), comprising at least one first layer (2) having a density value d1 and a thickness s1, and a second layer (3) adjacent to the first layer (2) having a density value d2<d1 and a thickness s2>s1, wherein the panel comprises chips of vegetal material agglomerated through at least one adhesive substance, in which the chips consist for at least 85% by weight over the weight of the vegetal material of essentially flat chips of wood-based material from planting, obtained from cuts along the axis of the fibre of the wood-based material, in which the grain of said wood-based material extends in the longitudinal direction of the flat chips, in which the chips of the first layer (2) have a first size and the chips of the second layer (3) have a second size greater than the first size that makes a woven mesh structure.

IPC 8 full level

B27N 1/00 (2006.01); B27N 3/04 (2006.01)

CPC (source: EP)

B27N 1/00 (2013.01); B27N 3/04 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2524782 A1 20121121; EP 2524782 A9 20130213

DOCDB simple family (application)

EP 11425136 A 20110520