EP 2524782 A1 20121121 - Low density multilayer chipboard panel and process for making said panel
Title (en)
Low density multilayer chipboard panel and process for making said panel
Title (de)
Mehrschichtige Spanplatte niedriger Dichte sowie Verfahren zur Herstellung einer Spanplatte
Title (fr)
Panneau aggloméré multicouche à faible densité et procédé de fabrication d'un panneau
Publication
Application
Priority
EP 11425136 A 20110520
Abstract (en)
The present invention provides a so-called "ultralight" multilayer chipboard panel (1), comprising at least one first layer (2) having a density value d1 and a thickness s1, and a second layer (3) adjacent to the first layer (2) having a density value d2<d1 and a thickness s2>s1, wherein the panel comprises chips of vegetal material agglomerated through at least one adhesive substance, in which the chips consist for at least 85% by weight over the weight of the vegetal material of essentially flat chips of wood-based material from planting, obtained from cuts along the axis of the fibre of the wood-based material, in which the grain of said wood-based material extends in the longitudinal direction of the flat chips, in which the chips of the first layer (2) have a first size and the chips of the second layer (3) have a second size greater than the first size that makes a woven mesh structure.
IPC 8 full level
CPC (source: EP)
Citation (search report)
- [XYI] DE 102005038734 A1 20070222 - MICHANICKL ANDREAS [DE]
- [XI] US 2007144663 A1 20070628 - BARKER JOEL [US], et al
- [Y] US 2006148363 A1 20060706 - LAVOIE GERARD [CA]
- [A] WO 2005018890 A1 20050303 - BARD MARKUS [CH]
- [A] US 4246310 A 19810120 - HUNT MICHAEL O, et al
- [A] US 2786005 A 19570319 - CLARK JAMES D A
- [A] US 2010092760 A1 20100415 - THOMAS JR WILLIAM ANDERSON [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 11425136 A 20110520