EP 2527405 B8 20130925 - Thermoplastic resin composition and resin molded article
Title (en)
Thermoplastic resin composition and resin molded article
Title (de)
Thermoplastische Harzzusammensetzung und Harzformartikel
Title (fr)
Composition de résine thermoplastique et article moulé en résine
Publication
Application
Priority
- EP 07737017 A 20070403
- JP 2006111289 A 20060413
Abstract (en)
[origin: EP2006333A1] The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 µm and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
IPC 8 full level
C08K 3/32 (2006.01); C08K 5/49 (2006.01); C08K 9/04 (2006.01); C08L 21/00 (2006.01); C08L 69/00 (2006.01); C08L 77/02 (2006.01); C08L 101/00 (2006.01)
CPC (source: EP US)
C08L 67/02 (2013.01 - EP US); C08L 69/00 (2013.01 - EP US); C08L 77/00 (2013.01 - EP US); C08K 3/346 (2013.01 - EP US); C08K 5/49 (2013.01 - EP US); C08L 21/00 (2013.01 - EP US); C08L 51/04 (2013.01 - EP US); C08L 77/02 (2013.01 - EP US); C08L 2205/02 (2013.01 - EP US); C08L 2205/03 (2013.01 - EP US)
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
EP 2006333 A1 20081224; EP 2006333 A4 20100526; EP 2006333 B1 20130220; CN 101421357 A 20090429; CN 101421357 B 20111116; CN 102120878 A 20110713; CN 102120878 B 20130306; EP 2527405 A1 20121128; EP 2527405 B1 20130807; EP 2527405 B8 20130925; JP 2007284502 A 20071101; JP 5168812 B2 20130327; US 2010010141 A1 20100114; US 8178608 B2 20120515; WO 2007129437 A1 20071115
DOCDB simple family (application)
EP 07737017 A 20070403; CN 200780012921 A 20070403; CN 201110031436 A 20070403; EP 12180662 A 20070403; JP 2006111289 A 20060413; JP 2007000360 W 20070403; US 29712707 A 20070403