EP 2528087 A3 20130320 - Formation of devices by epitaxial layer overgrowth
Title (en)
Formation of devices by epitaxial layer overgrowth
Title (de)
Formierung von Geräten durch übermässiges Wachstum der Epitaxialschicht
Title (fr)
Formation de dispositifs par sur-croissance de couches épitaxiales
Publication
Application
Priority
- EP 09815273 A 20090918
- US 9907408 P 20080922
- US 10446608 P 20081010
- US 9859708 P 20080919
Abstract (en)
[origin: WO2010033813A2] Methods and structures are provided for formation of devices, e.g., solar cells, on substrates including, e.g., lattice-mismatched materials, by the use of aspect ratio trapping (ART) and epitaxial layer overgrowth (ELO). In general, in a first aspect, embodiments of the invention may include a method of forming a structure. The method includes forming a first opening in a masking layer disposed over a substrate that includes a first semiconductor material. A first layer, which includes a second semiconductor material lattice-mismatched to the first semiconductor material, is formed within the first opening. The first layer has a thickness sufficient to extend above a top surface of the masking layer. A second layer, which includes the second semiconductor material, is formed on the first layer and over at least a portion of the masking layer. A vertical growth rate of the first layer is greater than a lateral growth rate of the first layer and a lateral growth rate of the second layer is greater than a vertical growth rate of the second layer.
IPC 8 full level
H01L 21/20 (2006.01); H01L 21/02 (2006.01); H01L 31/042 (2006.01); H01L 31/0687 (2012.01); H01L 31/18 (2006.01)
CPC (source: EP KR US)
H01L 21/02381 (2013.01 - EP US); H01L 21/0245 (2013.01 - EP US); H01L 21/02461 (2013.01 - EP US); H01L 21/02463 (2013.01 - EP US); H01L 21/02538 (2013.01 - US); H01L 21/02543 (2013.01 - EP US); H01L 21/02546 (2013.01 - EP US); H01L 21/02636 (2013.01 - EP US); H01L 21/02639 (2013.01 - EP US); H01L 21/02647 (2013.01 - EP US); H01L 21/20 (2013.01 - KR); H01L 29/205 (2013.01 - US); H01L 31/04 (2013.01 - KR); H01L 31/0687 (2013.01 - EP US); H01L 31/06875 (2013.01 - EP US); H01L 31/1808 (2013.01 - EP US); H01L 31/1852 (2013.01 - EP US); H01L 31/1892 (2013.01 - EP US); Y02E 10/544 (2013.01 - EP US)
Citation (search report)
- [I] EP 0966047 A2 19991222 - SUMITOMO ELECTRIC INDUSTRIES [JP]
- [I] JP 2006273716 A 20061012 - SUMITOMO ELECTRIC INDUSTRIES
- [Y] US 2004166681 A1 20040826 - ILES PETER A [US], et al
- [Y] US 2007267722 A1 20071122 - LOCHTEFELD ANTHONY J [US], et al
- [A] US 2001053618 A1 20011220 - KOZAKI TOKUYA [JP], et al
- [A] US 2007217460 A1 20070920 - ISHIBASHI AKIHIKO [JP], et al
- [A] LANGDO T A ET AL: "High quality Ge on Si by epitaxial necking", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 76, no. 25, 19 June 2000 (2000-06-19), pages 3700 - 3702, XP012025569, ISSN: 0003-6951, DOI: 10.1063/1.126754
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010033813 A2 20100325; WO 2010033813 A3 20100603; CN 102160145 A 20110817; CN 102160145 B 20130821; EP 2335273 A2 20110622; EP 2335273 A4 20120125; EP 2528087 A2 20121128; EP 2528087 A3 20130320; EP 2528087 B1 20160629; JP 2012503340 A 20120202; JP 5416212 B2 20140212; KR 101216541 B1 20121231; KR 20110056277 A 20110526; US 2010216277 A1 20100826; US 2012068226 A1 20120322; US 2013134480 A1 20130530; US 8034697 B2 20111011; US 8384196 B2 20130226; US 9934967 B2 20180403
DOCDB simple family (application)
US 2009057493 W 20090918; CN 200980136547 A 20090918; EP 09815273 A 20090918; EP 12177269 A 20090918; JP 2011528001 A 20090918; KR 20117002684 A 20090918; US 201113243521 A 20110923; US 201313737731 A 20130109; US 68087209 A 20090918