Global Patent Index - EP 2529860 A4

EP 2529860 A4 20170222 - PROCESS FOR PRODUCING COPPER ALLOY WIRE CONTAINING ACTIVE ELEMENT

Title (en)

PROCESS FOR PRODUCING COPPER ALLOY WIRE CONTAINING ACTIVE ELEMENT

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES KUPFERLEGIERUNGSDRAHTS MIT AKTIVEM ELEMENT

Title (fr)

PROCEDE POUR PRODUIRE UN FIL EN ALLIAGE DE CUIVRE CONTENANT UN ELEMENT ACTIF

Publication

EP 2529860 A4 20170222 (EN)

Application

EP 11737023 A 20110126

Priority

  • JP 2010014397 A 20100126
  • JP 2011051433 W 20110126

Abstract (en)

[origin: EP2529860A1] This method for producing a copper alloy wire containing an active element includes: a molten-copper formation step of melting a raw copper material to form a molten copper; an active-element addition step of adding an active element to the molten copper; a holding step of holding the molten copper in a casting furnace; and a casting step of producing an ingot continuously by a casting die connected to the casting furnace, wherein the casting die is connected to a lower side of the casting furnace in a vertical direction through a heat insulation member, and in the casting step, a pressure is applied toward the inside of the casting die so as to supply the molten copper into the casting die, and the molten copper is cooled and solidified in the casting die.

IPC 8 full level

B22D 11/00 (2006.01); B22D 11/041 (2006.01); B22D 11/055 (2006.01); B22D 11/059 (2006.01); B22D 11/103 (2006.01); C22C 1/02 (2006.01); C22C 9/00 (2006.01)

CPC (source: EP)

B22D 11/004 (2013.01); B22D 11/041 (2013.01); B22D 11/055 (2013.01); B22D 11/059 (2013.01); B22D 11/103 (2013.01); C22C 1/02 (2013.01); C22C 9/00 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2529860 A1 20121205; EP 2529860 A4 20170222; CN 102686337 A 20120919; CN 102686337 B 20150617; JP 5613907 B2 20141029; JP WO2011093310 A1 20130606; TW 201201925 A 20120116; TW I520799 B 20160211; WO 2011093310 A1 20110804

DOCDB simple family (application)

EP 11737023 A 20110126; CN 201180005192 A 20110126; JP 2011051433 W 20110126; JP 2011551866 A 20110126; TW 100102869 A 20110126