EP 2532024 A1 20121212 - METHOD FOR TREATING A TEMPORARILY BONDED PRODUCT WAFER
Title (en)
METHOD FOR TREATING A TEMPORARILY BONDED PRODUCT WAFER
Title (de)
VERFAHREN ZUR BEHANDLUNG EINES TEMPORÄR GEBONDETEN PRODUKTWAFERS
Title (fr)
PROCÉDÉ DE TRAITEMENT D'UNE TRANCHE PRODUITE LIÉE TEMPORAIREMENT
Publication
Application
Priority
- DE 102010007127 A 20100205
- EP 2010007098 W 20101123
Abstract (en)
[origin: WO2011095189A1] The invention relates to a method for treating a product wafer temporarily bonded to a carrier wafer, comprising the following steps: grinding and/or back-thinning the product wafer on a flat side facing away from the carrier wafer to a product wafer thickness D of < 150 µm, in particular < 100 µm, preferably < 75 µm, more preferably < 50 µm, especially preferably < 30 µm, and after the grinding and/or back-thinning, treating the surface of the flat side using means for reducing an, in particular structural, internal stress of the product wafer.
IPC 8 full level
H01L 21/683 (2006.01)
CPC (source: EP KR US)
H01L 21/304 (2013.01 - KR); H01L 21/683 (2013.01 - KR); H01L 21/6835 (2013.01 - EP KR US); H01L 21/6836 (2013.01 - EP US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/6834 (2013.01 - EP US)
Citation (search report)
See references of WO 2011095189A1
Citation (examination)
- US 2006008650 A1 20060112 - WESSELMANN MARK [US], et al
- US 2007077685 A1 20070405 - NODA KAZUKI [JP], et al
- US 2005173064 A1 20050811 - MIYANARI ATSUSHI [JP]
- US 2005085008 A1 20050421 - DERDERIAN JAMES M [US], et al
- US 2006121690 A1 20060608 - POGGE H B [US], et al
- US 2008200011 A1 20080821 - PILLALAMARRI SUNIL K [US], et al
- ANONYMOUS: "Thermal expansion - Wikipedia, the free encyclopedia", 25 August 2015 (2015-08-25), XP055209459, Retrieved from the Internet <URL:https://en.wikipedia.org/wiki/Thermal_expansion> [retrieved on 20150825]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010007127 A1 20110811; CN 102725838 A 20121010; CN 102725838 B 20160302; EP 2532024 A1 20121212; JP 2013519218 A 20130523; KR 101822669 B1 20180308; KR 20120120198 A 20121101; SG 182703 A1 20120830; TW 201145373 A 20111216; TW I525677 B 20160311; US 2012292288 A1 20121122; US 9362154 B2 20160607; WO 2011095189 A1 20110811
DOCDB simple family (application)
DE 102010007127 A 20100205; CN 201080063106 A 20101123; EP 10787688 A 20101123; EP 2010007098 W 20101123; JP 2012551501 A 20101123; KR 20127017583 A 20101123; SG 2012054839 A 20101123; TW 100104032 A 20110201; US 201013575316 A 20101123