EP 2537400 A1 20121226 - METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE
Title (en)
METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE
Title (de)
HERSTELLUNGSVERFAHREN FÜR EIN ELEKTRONISCHES GEHÄUSE
Title (fr)
PROCÉDÉ POUR FABRIQUER UN BOÎTIER ÉLECTRONIQUE
Publication
Application
Priority
- EP 10305158 A 20100216
- EP 2011052248 W 20110215
- EP 11703690 A 20110215
Abstract (en)
[origin: EP2357875A1] The method involves arranging (S1) a chip (1) on a trailed adhesive support (2), and molding (S2) resin (3) for coating the chip on the support. An island zone (10) is turned over (S3), so that the chip has exposed active face, where the island zone is formed by the assembly of the chip and resin. A conductive material is applied on the turned island zone for materializing a contact pad connecting a contact point (1a) of the chip to an exterior medium. Independent claims are also included for the following: (1) a system for manufacturing an electronic case, comprising an arranging unit (2) an electronic case comprising a chip.
IPC 8 full level
H05K 1/18 (2006.01); G06K 19/077 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01)
CPC (source: EP)
H01L 21/568 (2013.01); H01L 23/3114 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/96 (2013.01); H05K 1/185 (2013.01); H01L 21/561 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/1316 (2013.01)
Citation (search report)
See references of WO 2011101359A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2357875 A1 20110817; BR 112012020492 B1 20191210; CN 102754535 A 20121024; CN 102754535 B 20151125; EP 2537400 A1 20121226; WO 2011101359 A1 20110825
DOCDB simple family (application)
EP 10305158 A 20100216; BR 112012020492 A 20110215; CN 201180009603 A 20110215; EP 11703690 A 20110215; EP 2011052248 W 20110215