EP 2537657 A2 20121226 - Methods and materials for fabricating microfluidic devices

Title (en)

Methods and materials for fabricating microfluidic devices

Title (de)

Verfahren und Materialien zur Herstellung mikrofluidischer Vorrichtungen

Title (fr)

Procédés et matériaux permettant de fabriquer des dispositifs microfluidiques

Publication

EP 2537657 A2 20121226 (EN)

Application

EP 12185073 A 20060809

Priority

EP 06801056 A 20060809
US 70678605 P 20050809
US 73272705 P 20051102
US 79931706 P 20060510

Abstract (en)

Materials and methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents.

IPC 8 full level

B29C 33/38 (2006.01); C08G 65/00 (2006.01); C08L 71/00 (2006.01); C08L 81/04 (2006.01)

CPC (source: EP US)

B01L 3/502707 (2013.01 - EP US); B29C 33/3878 (2013.01 - EP US); B29C 33/405 (2013.01 - EP US); B29C 59/005 (2013.01 - US); B29C 65/48 (2013.01 - EP US); B29C 66/54 (2013.01 - EP US); B29C 66/543 (2013.01 - EP US); B29C 66/71 (2013.01 - EP US); B29C 66/723 (2013.01 - EP US); B29C 66/727 (2013.01 - EP US); B29C 66/91431 (2013.01 - EP US); B29C 66/919 (2013.01 - EP US); B29C 66/949 (2013.01 - EP US); B29C 66/9534 (2013.01 - EP US); B81C 99/0085 (2013.01 - EP US); C08G 18/10 (2013.01 - EP US); C08G 18/5015 (2013.01 - EP US); C08G 18/8175 (2013.01 - EP US); C08G 59/30 (2013.01 - EP US); C08G 65/007 (2013.01 - EP US); C08L 71/02 (2013.01 - US); C08L 75/16 (2013.01 - EP US); C09D 171/00 (2013.01 - EP); B01L 2300/0887 (2013.01 - EP US); B01L 2300/12 (2013.01 - EP US); B29C 65/4835 (2013.01 - EP US); B29C 65/4845 (2013.01 - EP US); B29C 65/485 (2013.01 - EP US); B29C 65/521 (2013.01 - EP US); B29K 2883/00 (2013.01 - EP US); B29L 2031/7172 (2013.01 - EP US); B29L 2031/756 (2013.01 - EP US); B81B 2201/051 (2013.01 - EP US); Y10T 137/0318 (2015.04 - EP US); Y10T 137/2224 (2015.04 - EP US)

C-Set (source: EP US)

Citation (applicant)

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Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

WO 2007021762 A2 20070222; WO 2007021762 A3 20070830; EP 1922364 A2 20080521; EP 1922364 A4 20100421; EP 2537657 A2 20121226; EP 2537657 A3 20160504; US 2009281250 A1 20091112; US 2012256354 A1 20121011; US 2013228950 A1 20130905; US 8158728 B2 20120417; US 8444899 B2 20130521

DOCDB simple family (application)

US 2006031067 W 20060809; EP 06801056 A 20060809; EP 12185073 A 20060809; US 201213438431 A 20120403; US 201313859323 A 20130409; US 6328406 A 20060809