EP 2539099 A1 20130102 - METHOD FOR APPLYING SOFT SOLDER TO A MOUNTING SURFACE OF A COMPONENT
Title (en)
METHOD FOR APPLYING SOFT SOLDER TO A MOUNTING SURFACE OF A COMPONENT
Title (de)
VERFAHREN ZUM AUFBRINGEN VON WEICHLOT AUF EINE MONTAGEFLÄCHE EINES BAUELEMENTES
Title (fr)
PROCÉDÉ POUR APPLIQUER DU MÉTAL D'APPORT DE BRASAGE SUR UNE SURFACE DE MONTAGE D'UNE PIÈCE
Publication
Application
Priority
- DE 102010002252 A 20100223
- EP 2011052592 W 20110222
Abstract (en)
[origin: WO2011104229A1] The invention relates to a method for applying soft solder (4) to a mounting surface (10) of a component (11), wherein a) a connecting means (1) comprising a carrier layer (2) and a soft solder layer (4) formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer (4) and the mounting surface (10), such that a first bond strength between the soft solder layer (4) and the mounting surface (10) is greater than a second bond strength between the soft solder layer (4) and the carrier layer (2), and b) the connecting means (1) is subsequently removed from the component (11) so that the carrier layer (2) releases from the soft solder layer (4) in the area of the mounting surface (10) and thus soft solder (4) remains only at the mounting surface (10).
IPC 8 full level
B23K 3/06 (2006.01); B23K 1/20 (2006.01); B23K 35/02 (2006.01)
CPC (source: EP US)
B23K 1/20 (2013.01 - EP US); B23K 3/0623 (2013.01 - EP US); B23K 3/0638 (2013.01 - EP US); B23K 35/001 (2013.01 - EP US); B23K 35/0233 (2013.01 - EP US); B23K 35/224 (2013.01 - EP US); B23K 35/26 (2013.01 - EP US); C23C 14/20 (2013.01 - EP US); Y10T 29/49117 (2015.01 - US); Y10T 29/49144 (2015.01 - US); Y10T 29/49146 (2015.01 - US); Y10T 29/49147 (2015.01 - US); Y10T 29/53174 (2015.01 - US)
Citation (search report)
See references of WO 2011104229A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010002252 A1 20110825; CN 102741004 A 20121017; CN 102741004 B 20151216; EP 2539099 A1 20130102; US 2012297616 A1 20121129; US 8745858 B2 20140610; WO 2011104229 A1 20110901
DOCDB simple family (application)
DE 102010002252 A 20100223; CN 201180008039 A 20110222; EP 11705206 A 20110222; EP 2011052592 W 20110222; US 201113578327 A 20110222