EP 2539947 A1 20130102 - PIEZOELECTRIC MULTILAYER COMPONENT AND METHOD FOR PRODUCING A PIEZOELECTRIC MULTILAYER COMPONENT
Title (en)
PIEZOELECTRIC MULTILAYER COMPONENT AND METHOD FOR PRODUCING A PIEZOELECTRIC MULTILAYER COMPONENT
Title (de)
PIEZOELEKTRISCHES VIELSCHICHTBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES PIEZOELEKTRISCHEN VIELSCHICHTBAUELEMENTS
Title (fr)
COMPOSANT MULTICOUCHE PIÉZOÉLECTRIQUE ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT MULTICOUCHE PIÉZOÉLECTRIQUE
Publication
Application
Priority
- DE 102010008775 A 20100222
- EP 2011052527 W 20110221
Abstract (en)
[origin: WO2011101473A1] The invention relates to a piezoelectric multilayer component (1) as an intermediate, which comprises a stack (2) of piezoelectric layers (3) arranged on top of one another. The stack (2) comprises an active region (6) having electrode layers (4) arranged between the piezoelectric layers (3) and at least one inactive region (7), wherein the active region (6) on the end product of the piezoelectric multilayer component (1) is provided for the purpose of deforming when a voltage is applied to the electrode layers (4). The inactive region (7) contains at least one sacrificial layer (8) which comprises an electrically insulating material and a metal, wherein the metal can diffuse at least partially from the sacrificial layer (8) into the piezoelectric layers (3) of the inactive region (7) by heating the multilayer component (1).
IPC 8 full level
H10N 30/50 (2023.01); H10N 30/01 (2023.01); H10N 30/053 (2023.01); H10N 30/093 (2023.01); H10N 30/097 (2023.01); H10N 30/20 (2023.01); H10N 30/853 (2023.01)
CPC (source: EP US)
H10N 30/053 (2023.02 - EP US); H10N 30/50 (2023.02 - EP US); Y10T 29/42 (2015.01 - EP US)
Citation (examination)
WO 2009092584 A1 20090730 - EPCOS AG [DE], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010008775 A1 20110825; CN 102754231 A 20121024; EP 2539947 A1 20130102; JP 2013520788 A 20130606; JP 5879272 B2 20160308; US 2013057114 A1 20130307; WO 2011101473 A1 20110825
DOCDB simple family (application)
DE 102010008775 A 20100222; CN 201180010514 A 20110221; EP 11704780 A 20110221; EP 2011052527 W 20110221; JP 2012553342 A 20110221; US 201113580598 A 20110221