EP 2541601 A1 20130102 - Method for producing an electromagnetic radiation detector
Title (en)
Method for producing an electromagnetic radiation detector
Title (de)
Herstellungsverfahren eines Detektors für elektromagnetische Strahlung
Title (fr)
Procédé pour la réalisation d'un détecteur de rayonnement électro-magnétique
Publication
Application
Priority
FR 1102031 A 20110630
Abstract (en)
The method for removing a cadmium zinc telluride growth substrate of a circuit for detecting electromagnetic radiation such as infrared or visible radiations, comprises subjecting the growth substrate to a mechanical polishing or chemical mechanical polishing step or an etching step to reduce its thickness to produce an interface zone between a material of the detection circuit and the growth substrate, and subjecting the interface to an iodine treatment. The iodine is present in the molecular form in solution comprising water and methanol as a solvent. The method for removing a cadmium zinc telluride growth substrate of a circuit for detecting electromagnetic radiation such as infrared or visible radiations, comprises subjecting the growth substrate to a mechanical polishing or chemical mechanical polishing step or an etching step to reduce its thickness to produce an interface zone between a material of the detection circuit and the growth substrate, and subjecting the interface to an iodine treatment. The iodine is present in the molecular form in solution comprising water and methanol as a solvent. The iodine treatment is performed in an acid medium preceded by deoxidizing action of the surface area of variation residual composition (5') after the mechanical polishing or chemical-mechanical polishing step or etching step, where the deoxidizing action is carried out by subjecting the interface zone to a bath including composition, and is performed by immersing a detector resulting from mechanical polishing and/or chemical-mechanical steps and/or etching step in the bath. The circuit includes a radiation detection layer made of mercury cadmium telluride (Hg ( 1 - x )Cd xTe) that is obtained by liquid or vapor phase epitaxy or by molecular beam epitaxy, and is hybridized on a read circuit. The growth substrate is made of a monocrystalline semiconductor in which a cadmium telluride lattice parameter adaptation layer is deposited. The adaptation layer has a thickness of several micrometers. The interface zone is subjected to chemical etching to remove the residual thickness of the growth substrate prior to subjecting the interface zone to the iodine treatment and after the step of mechanical polishing or chemical-mechanical polishing or etching step.
Abstract (fr)
Ce procédé vise l'élimination du substrat de croissance d'un circuit de détection de rayonnement électromagnétique, notamment dans le domaine de l'infrarouge ou du visible, ledit circuit de détection comportant une couche de détection dudit rayonnement réalisé en Hg (1 - x) Cd x Te obtenue par épitaxie en phase liquide ou gazeuse ou par épitaxie par jet moléculaire, ledit circuit de détection étant hybridé sur un circuit de lecture. Ce procédé consiste : €¢ à soumettre le substrat de croissance à une étape de polissage mécanique ou mécano chimique ou à une étape d'attaque chimique afin de réduire son épaisseur, jusqu'à aboutir à une zone d'interface entre le matériau du circuit de détection et le substrat de croissance ; €¢ puis à soumettre l'interface ainsi obtenu à un traitement iodé.
IPC 8 full level
H01L 27/146 (2006.01); H01L 31/0296 (2006.01); H01L 31/18 (2006.01)
CPC (source: EP US)
H01L 27/1465 (2013.01 - EP US); H01L 27/14696 (2013.01 - EP US); H01L 31/02966 (2013.01 - EP US); H01L 31/1832 (2013.01 - EP US); H01L 31/1892 (2013.01 - EP US); Y02E 10/50 (2013.01 - US)
Citation (applicant)
FR 2646558 A1 19901102 - COMMISSARIAT ENERGIE ATOMIQUE [FR]
Citation (search report)
- [Y] US 4783594 A 19881108 - SCHULTE ERIC F [US], et al
- [A] US 5751049 A 19980512 - GOODWIN MICHAEL W [US]
- [Y] IVANITSÂ KA V G ET AL: "Chemical Polishing of CdTe and CdZnTe in Iodineâ Methanol Etching Solutions", JOURNAL OF ELECTRONIC MATERIALS, SPRINGER US, BOSTON, vol. 40, no. 8, 6 May 2011 (2011-05-06), pages 1802 - 1808, XP019921485, ISSN: 1543-186X, DOI: 10.1007/S11664-011-1649-2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2541601 A1 20130102; EP 2541601 B1 20180808; CN 102856429 A 20130102; CN 102856429 B 20161207; FR 2977372 A1 20130104; FR 2977372 B1 20151218; IL 220505 A 20170131; JP 2013016796 A 20130124; JP 5982195 B2 20160831; US 2013005068 A1 20130103; US 8900907 B2 20141202
DOCDB simple family (application)
EP 12173327 A 20120625; CN 201210219570 A 20120627; FR 1102031 A 20110630; IL 22050512 A 20120619; JP 2012143911 A 20120627; US 201213529256 A 20120621