EP 2548158 A1 20130123 - LAMINATE STRUCTURE FOR A CHIP CARD AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
LAMINATE STRUCTURE FOR A CHIP CARD AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
LAMINATAUFBAU FÜR EINE CHIPKARTE UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
STRUCTURE STRATIFIÉE POUR UNE CARTE À PUCE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102010011517 A 20100315
- EP 2011000752 W 20110217
Abstract (en)
[origin: CA2790932A1] The invention relates to a laminate structure (30) for a chip card (31), comprising a base layer (35), a chip module (32) accommodated at least proportionately in the base layer, and at least one cover layer (39) that covers the base layer, wherein an intermediate space (61) formed between the chip module and the cover layer and between the chip module and the base layer is filled with an adhesive material, wherein the adhesive material forms adhesive forces with respect to the wetted surfaces of the base layer and of the cover layer and adhesive forces with respect to the wetted surfaces of the chip module.
IPC 8 full level
G06K 19/077 (2006.01); H01L 23/28 (2006.01); H01Q 1/12 (2006.01)
CPC (source: EP KR US)
G06K 19/077 (2013.01 - KR); G06K 19/07722 (2013.01 - US); G06K 19/07745 (2013.01 - EP US); H01L 23/28 (2013.01 - KR); H01Q 1/12 (2013.01 - KR); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 2011113511A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010011517 A1 20110915; AU 2011229541 A1 20120927; BR 112012023155 A2 20160531; CA 2790932 A1 20110922; EP 2548158 A1 20130123; JP 2013522738 A 20130613; KR 20130012019 A 20130130; MX 2012010460 A 20121009; US 2013277432 A1 20131024; WO 2011113511 A1 20110922; ZA 201206797 B 20150429
DOCDB simple family (application)
DE 102010011517 A 20100315; AU 2011229541 A 20110217; BR 112012023155 A 20110217; CA 2790932 A 20110217; EP 11707081 A 20110217; EP 2011000752 W 20110217; JP 2012557425 A 20110217; KR 20127026166 A 20110217; MX 2012010460 A 20110217; US 201113634291 A 20110217; ZA 201206797 A 20120911