EP 2551375 A1 20130130 - Electroless nickel plating bath composition
Title (en)
Electroless nickel plating bath composition
Title (de)
Stromlose Vernickelungsbadzusammensetzung
Title (fr)
Composition de bain pour placage autocatalytique de nickel
Publication
Application
Priority
EP 11175295 A 20110726
Abstract (en)
The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt.-%. The plating bath comprises a sulfur-containing organic stabilising agent.
IPC 8 full level
C23C 18/36 (2006.01)
CPC (source: EP US)
C23C 18/36 (2013.01 - EP US)
Citation (applicant)
- US 2830014 A 19580408 - WOLFGANG GUNDEL, et al
- US 2005013928 A1 20050120 - MARUMO YOSHINORI [JP]
Citation (search report)
- [Y] CH 620710 A5 19801215 - POTAPOV FEDOR PETROVICH, et al
- [Y] GB 2155041 A 19850918 - OMI INT CORP
- [XY] US 2006264043 A1 20061123 - STEWART MICHAEL P [US], et al
- [Y] DATABASE WPI Week 197508, Derwent World Patents Index; AN 1975-13728W, XP002661625
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2551375 A1 20130130; CN 103946420 A 20140723; CN 103946420 B 20151125; EP 2737107 A1 20140604; EP 2737107 B1 20150909; JP 2014521834 A 20140828; JP 6053785 B2 20161227; KR 101936977 B1 20190109; KR 20140041762 A 20140404; TW 201309844 A 20130301; TW I555878 B 20161101; US 2014150689 A1 20140605; WO 2013013941 A1 20130131
DOCDB simple family (application)
EP 11175295 A 20110726; CN 201280036718 A 20120704; EP 12743909 A 20120704; EP 2012062967 W 20120704; JP 2014522015 A 20120704; KR 20147001368 A 20120704; TW 101127003 A 20120726; US 201214131949 A 20120704