EP 2551384 A1 20130130 - COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURE FOR SAME
Title (en)
COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURE FOR SAME
Title (de)
KUPFERLEGIERUNG FÜR EIN ELEKTRONISCHES MATERIAL UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
ALLIAGE DE CUIVRE POUR UN MATÉRIEL ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE CE DERNIER
Publication
Application
Priority
- JP 2010066397 A 20100323
- JP 2011057026 W 20110323
Abstract (en)
There is provided a copper alloy for electronic material which exhibits excellent plating uniformity. A copper alloy for electronic material, wherein, when its cross section parallel to a rolling direction is observed by SIM, an area ratio of amorphous structure and crystal grains having a grain size of less than 0.1 µ m at a depth range of 0.5 µ m or less from the surface is 1% or less, and a ratio of the number of crystal grains having a grain size of at least 0.1 µ m and less than 0.2 µ m to the overall number of crystal grains having a grain size of at least 0.1 µ m at a depth range of 0.2-0.5 µ m from the surface is 47.5% or more.
IPC 8 full level
C25D 5/34 (2006.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 9/10 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP KR US)
C22C 9/02 (2013.01 - EP KR); C22C 9/06 (2013.01 - EP KR); C25D 5/34 (2013.01 - EP KR); C25D 7/00 (2013.01 - EP KR US); C25D 7/06 (2013.01 - EP); C25D 7/0614 (2013.01 - KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2551384 A1 20130130; EP 2551384 A4 20170719; CN 102803574 A 20121128; CN 102803574 B 20150902; JP 2011195927 A 20111006; JP 4629154 B1 20110209; KR 101335201 B1 20131129; KR 20120114341 A 20121016; MX 2012010887 A 20121217; TW 201139703 A 20111116; TW I429763 B 20140311; WO 2011118650 A1 20110929
DOCDB simple family (application)
EP 11759455 A 20110323; CN 201180015302 A 20110323; JP 2010066397 A 20100323; JP 2011057026 W 20110323; KR 20127020755 A 20110323; MX 2012010887 A 20110323; TW 100109511 A 20110321