EP 2551384 A4 20170719 - COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURE FOR SAME
Title (en)
COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURE FOR SAME
Title (de)
KUPFERLEGIERUNG FÜR EIN ELEKTRONISCHES MATERIAL UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
ALLIAGE DE CUIVRE POUR UN MATÉRIEL ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE CE DERNIER
Publication
Application
Priority
- JP 2010066397 A 20100323
- JP 2011057026 W 20110323
Abstract (en)
[origin: EP2551384A1] There is provided a copper alloy for electronic material which exhibits excellent plating uniformity. A copper alloy for electronic material, wherein, when its cross section parallel to a rolling direction is observed by SIM, an area ratio of amorphous structure and crystal grains having a grain size of less than 0.1 µ m at a depth range of 0.5 µ m or less from the surface is 1% or less, and a ratio of the number of crystal grains having a grain size of at least 0.1 µ m and less than 0.2 µ m to the overall number of crystal grains having a grain size of at least 0.1 µ m at a depth range of 0.2-0.5 µ m from the surface is 47.5% or more.
IPC 8 full level
B24B 37/00 (2012.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 9/10 (2006.01); C25D 5/34 (2006.01); C25D 7/00 (2006.01); C25D 7/06 (2006.01)
CPC (source: EP KR US)
C22C 9/02 (2013.01 - EP KR); C22C 9/06 (2013.01 - EP KR); C25D 5/34 (2013.01 - EP KR); C25D 7/00 (2013.01 - EP KR US); C25D 7/06 (2013.01 - EP); C25D 7/0614 (2013.01 - KR)
Citation (search report)
- [X] US 2007015001 A1 20070118 - UNO TAKEO [JP], et al
- [X] WO 9514121 A1 19950526 - ONTARIO HYDRO [CA], et al
- [XI] CN 101215698 A 20080709 - UNIV TIANJIN [CN]
- [AD] JP 2006002233 A 20060105 - FURUKAWA ELECTRIC CO LTD
- [A] WO 2009099198 A1 20090813 - FURUKAWA ELECTRIC CO LTD [JP], et al & EP 2243847 A1 20101027 - FURUKAWA ELECTRIC CO LTD [JP]
- See references of WO 2011118650A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2551384 A1 20130130; EP 2551384 A4 20170719; CN 102803574 A 20121128; CN 102803574 B 20150902; JP 2011195927 A 20111006; JP 4629154 B1 20110209; KR 101335201 B1 20131129; KR 20120114341 A 20121016; MX 2012010887 A 20121217; TW 201139703 A 20111116; TW I429763 B 20140311; WO 2011118650 A1 20110929
DOCDB simple family (application)
EP 11759455 A 20110323; CN 201180015302 A 20110323; JP 2010066397 A 20100323; JP 2011057026 W 20110323; KR 20127020755 A 20110323; MX 2012010887 A 20110323; TW 100109511 A 20110321