EP 2558244 A2 20130220 - SOLDER ALLOY, SOLDERING METHOD AND COMPONENT
Title (en)
SOLDER ALLOY, SOLDERING METHOD AND COMPONENT
Title (de)
LOTLEGIERUNG, LOTVERFAHREN UND BAUTEIL
Title (fr)
ALLIAGE DE BRASAGE, PROCÉDÉ DE BRASAGE ET PIÈCE CORRESPONDANTE
Publication
Application
Priority
EP 2010054756 W 20100412
Abstract (en)
[origin: US2013045129A1] A solder alloy including a base material, a solder, and an additive is provided. The solder alloy has the following formula: (1−x−y)*base material+x*solder+y*additive, where 0.2≰x≰0.8 and 0≰y<0.8 and also (y<1−x)<(1−x). The base material includes chromium, cobalt, aluminum, and tungsten. The solder includes chromium, cobalt, aluminum, tungsten, germanium and/or gallium and nickel. The additive may include boron, zirconium, hafnium, niobium, and carbon.
IPC 8 full level
B23K 35/00 (2006.01); F01D 5/00 (2006.01)
CPC (source: EP US)
B23K 35/30 (2013.01 - EP US); F01D 5/005 (2013.01 - EP US); F05D 2230/238 (2013.01 - EP US); Y02T 50/60 (2013.01 - US)
Citation (search report)
See references of WO 2011127958A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2011127958 A2 20111020; EP 2558244 A2 20130220; US 2013045129 A1 20130221
DOCDB simple family (application)
EP 2010054756 W 20100412; EP 10713921 A 20100412; US 201013639142 A 20100412