EP 2561373 B1 20150603 - METHOD AND DEVICE FOR STRESSING AN INTEGRATED CIRCUIT
Title (en)
METHOD AND DEVICE FOR STRESSING AN INTEGRATED CIRCUIT
Title (de)
VERFAHREN UND GERÄT ZUR BELASTUNG EINER INTEGRIERTE SCHALTUNG
Title (fr)
PROCÉDÉS ET DISPOSITIFS DE MISE SOUS CONTRAINTE D'UN CIRCUIT INTÉGRÉ
Publication
Application
Priority
- FR 1052978 A 20100420
- EP 2011056235 W 20110419
Abstract (en)
[origin: WO2011131669A1] The subject of the present invention is in particular a device (2) for stressing an integrated circuit (1) comprising an electronic chip (10) mounted in a package (12), said device comprising a source (20) of thermal stress. The device (2) also comprises a thermally conductive coupling member (22) intended to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) comprises an end (220) having a geometry suited to introduction into an aperture having a preset geometry, which is to be produced in the package (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).
IPC 8 full level
G01R 31/28 (2006.01); H01L 23/34 (2006.01)
CPC (source: EP US)
G01R 31/2863 (2013.01 - EP US); G01R 31/2874 (2013.01 - EP US); G01R 31/311 (2013.01 - EP US); G01R 31/2898 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
FR 2959018 A1 20111021; FR 2959018 B1 20120831; BR 112012027002 A2 20160719; CA 2797015 A1 20111027; CN 103038654 A 20130410; CN 103038654 B 20151125; EP 2561373 A1 20130227; EP 2561373 B1 20150603; EP 2910960 A1 20150826; ES 2545008 T3 20150907; IL 222523 A0 20121231; US 2013193995 A1 20130801; US 9618567 B2 20170411; WO 2011131669 A1 20111027
DOCDB simple family (application)
FR 1052978 A 20100420; BR 112012027002 A 20110419; CA 2797015 A 20110419; CN 201180025044 A 20110419; EP 11715703 A 20110419; EP 15160816 A 20110419; EP 2011056235 W 20110419; ES 11715703 T 20110419; IL 22252312 A 20121018; US 201113641984 A 20110419