EP 2561729 A1 20130227 - PRINTED CIRCUIT BOARD WITH CAVITY
Title (en)
PRINTED CIRCUIT BOARD WITH CAVITY
Title (de)
LEITERPLATTE MIT HOHLRAUM
Title (fr)
CARTE DE CIRCUIT IMPRIMÉ COMPORTANT UN ESPACE CREUX
Publication
Application
Priority
- DE 102010018499 A 20100422
- EP 2011002036 W 20110421
Abstract (en)
[origin: WO2011131362A1] The present invention relates to a printed circuit board multilayer construction comprising a layer stack composed of a plurality of electrically insulating and/or conductive layers (1, 7) arranged one above another and a cavity (8) in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.
IPC 8 full level
H05K 1/18 (2006.01); G01L 19/06 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP US)
G01L 19/0645 (2013.01 - EP US); H05K 1/02 (2013.01 - US); H05K 1/0306 (2013.01 - US); H05K 3/0067 (2013.01 - US); H05K 3/4697 (2013.01 - EP US); H05K 1/0243 (2013.01 - EP US); H05K 1/183 (2013.01 - EP US); H05K 2201/10083 (2013.01 - EP US); H05K 2201/10151 (2013.01 - EP US); H05K 2203/063 (2013.01 - EP US); H05K 2203/1147 (2013.01 - EP US); Y10T 156/1062 (2015.01 - EP US)
Citation (search report)
See references of WO 2011131362A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010018499 A1 20111027; CN 102948266 A 20130227; EP 2561729 A1 20130227; EP 2561729 B1 20161026; JP 2013526024 A 20130620; US 2013199829 A1 20130808; US 9232647 B2 20160105; WO 2011131362 A1 20111027
DOCDB simple family (application)
DE 102010018499 A 20100422; CN 201180031167 A 20110421; EP 11720030 A 20110421; EP 2011002036 W 20110421; JP 2013505366 A 20110421; US 201113641860 A 20110421