EP 2564677 A1 20130306 - METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING PARALLEL PROCESSES TO INTERCONNECT WITH SUBASSEMBLIES
Title (en)
METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING PARALLEL PROCESSES TO INTERCONNECT WITH SUBASSEMBLIES
Title (de)
VERFAHREN ZUR HERSTELLUNG VON LEITERPLATTEN MIT PARALLELVERFAHREN ZUR VERBINDUNG MIT BAUGRUPPEN
Title (fr)
PROCÉDÉS DE FABRICATION DE CARTES DE CIRCUIT IMPRIMÉ UTILISANT DES PROCESSUS PARALLÈLES EN VUE D'OBTENIR UNE INTERCONNEXION AVEC DES SOUS-ENSEMBLES
Publication
Application
Priority
US 2010033295 W 20100430
Abstract (en)
[origin: WO2011136817A1] Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.
IPC 8 full level
H05K 3/46 (2006.01)
CPC (source: EP KR)
H05K 1/16 (2013.01 - KR); H05K 3/4069 (2013.01 - KR); H05K 3/4617 (2013.01 - KR); H05K 3/4623 (2013.01 - EP KR); H05K 3/4069 (2013.01 - EP); H05K 3/4617 (2013.01 - EP); H05K 2201/09527 (2013.01 - EP KR); H05K 2201/096 (2013.01 - EP KR); H05K 2203/061 (2013.01 - EP KR)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2011136817 A1 20111103; CN 103026805 A 20130403; EP 2564677 A1 20130306; EP 2564677 A4 20150624; KR 101694575 B1 20170109; KR 20130059356 A 20130605
DOCDB simple family (application)
US 2010033295 W 20100430; CN 201080067843 A 20100430; EP 10850903 A 20100430; KR 20127031290 A 20100430