EP 2570009 A1 20130320 - POWER ELECTRONIC ARRANGEMENT
Title (en)
POWER ELECTRONIC ARRANGEMENT
Title (de)
LEISTUNGSELEKTRONIKANORDNUNG
Title (fr)
DISPOSITIF ÉLECTRONIQUE DE PUISSANCE
Publication
Application
Priority
- DE 102010028927 A 20100512
- EP 2011055162 W 20110404
Abstract (en)
[origin: WO2011141234A1] Power electronic arrangement (1) comprising a cooling device (2), one or a plurality of capacitors and one or a plurality of circuits, wherein at least one capacitor is electrically connected to at least one circuit, and wherein at least one circuit is arranged on the cooling device, wherein the power electronic arrangement (1) furthermore has a carrier (13) having a carrier base body (14) and at least one connecting element (15) provided for fixing to the cooling device (2), wherein at least one capacitor is accommodated, in particular placed and supported, on the carrier base body (14), and wherein the circuit arranged on the cooling device (2) is arranged on a side of the cooling device (2) which faces the carrier base body (14).
IPC 8 full level
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H05K 7/14 (2006.01)
CPC (source: EP US)
H05K 7/1432 (2013.01 - US); H05K 7/14329 (2022.08 - EP); H05K 7/20 (2013.01 - US); H05K 7/20927 (2013.01 - EP US); H02M 7/003 (2013.01 - EP US)
Citation (search report)
See references of WO 2011141234A1
Citation (examination)
EP 1713169 A1 20061018 - HITACHI LTD [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010028927 A1 20111117; CN 102893714 A 20130123; CN 102893714 B 20150429; EP 2570009 A1 20130320; US 2013114206 A1 20130509; WO 2011141234 A1 20111117
DOCDB simple family (application)
DE 102010028927 A 20100512; CN 201180023638 A 20110404; EP 11711893 A 20110404; EP 2011055162 W 20110404; US 201113697482 A 20110404