EP 2570204 B1 20181031 - Method and assembly for heating a metal circuit board
Title (en)
Method and assembly for heating a metal circuit board
Title (de)
Verfahren und Anordnung zum Erwärmen einer Metallplatine
Title (fr)
Procédé et agencement destinés à chauffer une platine de métal
Publication
Application
Priority
DE 102011053672 A 20110916
Abstract (en)
[origin: EP2570204A2] The method involves positioning the heating units (6,11) of a heating device (1), between a lower contact element (5) and an upper contact element (9). The receiving portions (4,8) are integrated with the contact elements (5,9) and made of highly heat conductive material having a conductivity of 150 W/mK. A metal circuit board (2) is positioned between the contact elements, and heated under a pressure for a period of less than 120 seconds, in a heating phase to a temperature of 200-450[deg] . An independent claim is included for arrangement for heating a metal circuit board.
IPC 8 full level
B21D 22/02 (2006.01); B21D 37/16 (2006.01); C21D 1/34 (2006.01); C21D 9/46 (2006.01)
CPC (source: EP US)
B21D 22/022 (2013.01 - EP US); B21D 37/16 (2013.01 - EP US); C21D 1/34 (2013.01 - EP US); C21D 9/46 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2570204 A2 20130320; EP 2570204 A3 20131225; EP 2570204 B1 20181031; DE 102011053672 A1 20130321; DE 102011053672 B4 20170810; US 2013068756 A1 20130321
DOCDB simple family (application)
EP 12181241 A 20120821; DE 102011053672 A 20110916; US 201213621638 A 20120917