EP 2572850 A1 20130327 - Sacrificial substrate for use in wafer cutting
Title (en)
Sacrificial substrate for use in wafer cutting
Title (de)
Opfersubstrat zur Verwendung beim Schneiden von Wafern
Title (fr)
Substrat sacrificielle à utiliser dans un découpage de tranche
Publication
Application
Priority
- EP 11182589 A 20110923
- EP 11190570 A 20111124
Abstract (en)
The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3), such as an ingot, brick or core, for cutting a plurality of wafers from the piece of material (3), wherein the sacrificial substrate (1) has an E-modulus smaller than 6000 MPa, more preferably smaller than 5000 MPa, most preferably smaller than 4000 MPa. The invention also relates to a method of making a plurality of wafers of a piece of material (3), such as an ingot, brick or core, comprising the steps of: mounting the piece of material (3) to a sacrificial substrate (1), preferably by gluing; mounting the sacrificial substrate (1) with the piece of material (3) in a cutting device; and cutting the piece of material (3) into a plurality of wafers.
IPC 8 full level
B28D 5/00 (2006.01)
CPC (source: EP)
B28D 5/0082 (2013.01)
Citation (applicant)
- WO 2010128011 A1 20101111 - MEYER BURGER AG [CH], et al
- EP 2111960 A1 20091028 - APPLIED MATERIALS SWITZERLAND [CH], et al
Citation (search report)
- [XY] DE 2044482 A1 19720323
- [XY] US 2009199836 A1 20090813 - GUPTA PUNEET [US]
- [Y] WO 2009040109 A1 20090402 - SCHOTT AG [DE], et al
- [A] US 2011162504 A1 20110707 - DOI YUHITO [JP], et al
- [AD] EP 2111960 A1 20091028 - APPLIED MATERIALS SWITZERLAND [CH], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2572850 A1 20130327; CN 103958140 A 20140730; CN 103958140 B 20200609; IN 3101DEN2014 A 20150515; WO 2013042055 A1 20130328
DOCDB simple family (application)
EP 11190570 A 20111124; CN 201280057521 A 20120919; IB 2012054972 W 20120919; IN 3101DEN2014 A 20140418