EP 2574974 B1 20170412 - Method of manufacturing optical deflector by forming dicing street with double etching
Title (en)
Method of manufacturing optical deflector by forming dicing street with double etching
Title (de)
Verfahren zur Herstellung eines optischen Deflektors durch Ausbildung einer Schneidstraße mit Doppelätzung
Title (fr)
Procédé de fabrication de déflecteur optique par la formation de découpage de rue avec double gravure
Publication
Application
Priority
JP 2011215622 A 20110929
Abstract (en)
[origin: EP2574974A1] A wafer-level optical deflector assembly (406ˆ¼ 413) is formed on a front surface side of a wafer (401ˆ¼ 404). Then, the front surface side of the wafer is etched by using elements of the wafer-level optical deflector assembly, to form a front-side dicing street (Y1). Then, a transparent substrate (501) with an inside cavity (501a) is adhered to the front surface side of the wafer. Then, a second etching mask (405) is formed on a back surface side of the wafer. Then, the back surface side of the wafer is etched to create a back-side dicing street (Y2). Then, an adhesive sheet (505) with a ring-shaped rim (506) is adhered to the back surface side of the wafer. Then, the transparent substrate is removed. Finally, the ring-shaped rim is expanded to widen the front-side dicing street and the back-side dicing street to pick up optical deflectors one by one from the wafer.
IPC 8 full level
G02B 26/10 (2006.01); B81C 1/00 (2006.01); G02B 26/08 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP US)
B81C 1/00873 (2013.01 - EP US); G02B 26/101 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 21/6836 (2013.01 - EP US); B81B 2201/042 (2013.01 - EP US); G02B 26/0858 (2013.01 - EP US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/68336 (2013.01 - EP US); H01L 2221/68381 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2574974 A1 20130403; EP 2574974 B1 20170412; CN 103033927 A 20130410; CN 103033927 B 20160406; JP 2013076781 A 20130425; JP 5775409 B2 20150909; US 2013084661 A1 20130404; US 8790936 B2 20140729
DOCDB simple family (application)
EP 12006663 A 20120921; CN 201210376372 A 20120929; JP 2011215622 A 20110929; US 201213613847 A 20120913