Global Patent Index - EP 2577757 A1

EP 2577757 A1 20130410 - PIEZOELECTRIC MULTILAYER COMPONENT AND METHOD FOR FORMING AN EXTERNAL ELECTRODE IN A PIEZOELECTRIC MULTILAYER COMPONENT

Title (en)

PIEZOELECTRIC MULTILAYER COMPONENT AND METHOD FOR FORMING AN EXTERNAL ELECTRODE IN A PIEZOELECTRIC MULTILAYER COMPONENT

Title (de)

PIEZOELEKTRISCHES VIELSCHICHTBAUELEMENT UND VERFAHREN ZUR AUSBILDUNG EINER AUSSENELEKTRODE BEI EINEM PIEZOELEKTRISCHEN VIELSCHICHTBAUELEMENT

Title (fr)

COMPOSANT MULTICOUCHE PIÉZOÉLECTRIQUE ET PROCÉDÉ POUR FORMER UNE ÉLECTRODE EXTÉRIEURE SUR UN COMPOSANT MULTICOUCHE PIÉZOÉLECTRIQUE

Publication

EP 2577757 A1 20130410 (DE)

Application

EP 11723469 A 20110606

Priority

  • DE 102010022925 A 20100607
  • EP 2011059271 W 20110606

Abstract (en)

[origin: WO2011154348A1] A piezoelectric multilayer component (1) is specified, wherein at least one external electrode (6, 6a, 6b) is fixed to a stack (2) composed of piezoelectric layers (3) and electrode layers (4) arranged therebetween, wherein at least one region (8) of the external electrode (6, 6a, 6b) projects beyond the stack (2) and the external electrode (6, 6a, 6b) is at least partly pressure-deformed in said region (8). Furthermore, a method for forming an external electrode (6, 6a, 6b) in a piezoelectric multilayer component (1) is specified.

IPC 8 full level

H01L 41/047 (2006.01); H01L 41/083 (2006.01); H01L 41/22 (2013.01); H01L 41/29 (2013.01); H01L 41/293 (2013.01)

CPC (source: EP US)

H10N 30/063 (2023.02 - EP US); H10N 30/872 (2023.02 - EP US); Y10T 29/42 (2015.01 - EP US)

Citation (search report)

See references of WO 2011154348A1

Citation (examination)

WO 0191199 A1 20011129 - BOSCH GMBH ROBERT [DE], et al

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102010022925 A1 20111208; DE 102010022925 B4 20190307; CN 102918671 A 20130206; EP 2577757 A1 20130410; JP 2013533616 A 20130822; US 2013140960 A1 20130606; US 9214621 B2 20151215; WO 2011154348 A1 20111215

DOCDB simple family (application)

DE 102010022925 A 20100607; CN 201180028272 A 20110606; EP 11723469 A 20110606; EP 2011059271 W 20110606; JP 2013513644 A 20110606; US 201113702526 A 20110606