EP 2578708 A4 20140409 - CU-CO-SI-BASED ALLOY SHEET, AND PROCESS FOR PRODUCTION THEREOF
Title (en)
CU-CO-SI-BASED ALLOY SHEET, AND PROCESS FOR PRODUCTION THEREOF
Title (de)
LEGIERUNGSFOLIE AUF CU-CO-SI-BASIS SOWIE HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
TÔLE EN UN ALLIAGE À BASE DE CU-CO-SI ET SON PROCÉDÉ DE PRODUCTION
Publication
Application
Priority
- JP 2010127943 A 20100603
- JP 2011057216 W 20110324
Abstract (en)
[origin: EP2578708A1] The present invention provides a Cu-Co-Si system alloy sheet, being suitable for use in a variety of electronic device components, in particular, having excellent uniform adhesive property for plate. The copper alloy sheet for electronic materials, contains 0.5 to 3.0 mass% Co, 0.1 to 1.0 mass% Si, the balance being Cu and unavoidable impurities, wherein an average grain size in the center part of the sheet thickness is 20 µm or less, and the number of the crystal grain, being tangent to a surface of the sheet and having 45 µm or more of the length of major axis, is 5 or less in the area of 1 mm in a rolling direction.
IPC 8 full level
C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01)
CPC (source: EP US)
C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01B 1/026 (2013.01 - EP US)
Citation (search report)
- [X] JP 2010059543 A 20100318 - FURUKAWA ELECTRIC CO LTD
- [X] WO 2010013790 A1 20100204 - FURUKAWA ELECTRIC CO LTD [JP], et al & US 2011186192 A1 20110804 - MIHARA KUNITERU [JP], et al
- [A] JP 2009242932 A 20091022 - NIPPON MINING CO
- [A] WO 2009096546 A1 20090806 - FURUKAWA ELECTRIC CO LTD [JP], et al & US 2010326573 A1 20101230 - MIHARA KUNITERU [JP], et al
- [A] WO 2010016428 A1 20100211 - FURUKAWA ELECTRIC CO LTD [JP], et al & US 2011200480 A1 20110818 - MATSUO RYOSUKE [JP], et al
- [E] EP 2386665 A1 20111116 - JX NIPPON MINING & METALS CORP [JP]
- See references of WO 2011152104A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2578708 A1 20130410; EP 2578708 A4 20140409; CN 102666890 A 20120912; CN 102666890 B 20140507; JP 2011252216 A 20111215; JP 4708497 B1 20110622; TW 201200606 A 20120101; TW I422693 B 20140111; US 2013092297 A1 20130418; WO 2011152104 A1 20111208
DOCDB simple family (application)
EP 11789514 A 20110324; CN 201180003593 A 20110324; JP 2010127943 A 20100603; JP 2011057216 W 20110324; TW 100113320 A 20110418; US 201113581715 A 20110324