EP 2582476 A2 20130424 - METHOD AND DEVICE FOR SETTING CONNECTING ELEMENTS THAT ARE SELF-DRILLING WITHOUT CHIP FORMATION
Title (en)
METHOD AND DEVICE FOR SETTING CONNECTING ELEMENTS THAT ARE SELF-DRILLING WITHOUT CHIP FORMATION
Title (de)
VERFAHREN UND VORRICHTUNG ZUM SETZEN VON SPANLOS SELBSTLOCHFORMENDEN VERBINDUNGSELEMENTEN
Title (fr)
PROCÉDÉ ET DISPOSITIF POUR METTRE EN PLACE DES ÉLÉMENTS DE LIAISON AUTO-TARAUDANTS SANS ENLÈVEMENT DE MATIÈRE
Publication
Application
Priority
- DE 102010024000 A 20100616
- DE 2011050019 W 20110609
Abstract (en)
[origin: CA2804291A1] The invention relates to a method for setting connecting elements (16), such as screws or blind rivets, which are self-drilling without chip formation, in one or more plates, wherein the plate(s) are heated by electrical energy shortly before the start of the setting process, wherein the heating is accomplished by means of an induction coil (26), which is arranged near a point on the plate(s) at which the connecting element (16) is set. The invention further relates to a device (10) for setting a connecting element (16), which is self-drilling without chip formation, in one or more plates, comprising an induction coil (26), which at least before and/or during the setting process is arranged near a point on the plate(s), at which the connecting element (16) is set.
IPC 8 full level
B21J 15/02 (2006.01); B21J 5/06 (2006.01); B21J 15/08 (2006.01)
CPC (source: EP KR US)
B21D 39/03 (2013.01 - EP US); B21J 5/06 (2013.01 - KR); B21J 5/066 (2013.01 - EP US); B21J 15/02 (2013.01 - KR US); B21J 15/025 (2013.01 - EP US); B21J 15/08 (2013.01 - EP KR US); Y10T 29/49833 (2015.01 - EP US); Y10T 29/5343 (2015.01 - EP US)
Citation (search report)
See references of WO 2012019601A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010024000 A1 20111222; AU 2011288686 A1 20130131; BR 112012031509 A2 20161108; CA 2804291 A1 20120216; CN 103037999 A 20130410; EP 2582476 A2 20130424; JP 2013530842 A 20130801; KR 20130040950 A 20130424; MX 2012014648 A 20130221; US 2013133173 A1 20130530; WO 2012019601 A2 20120216; WO 2012019601 A3 20120405
DOCDB simple family (application)
DE 102010024000 A 20100616; AU 2011288686 A 20110609; BR 112012031509 A 20110609; CA 2804291 A 20110609; CN 201180029887 A 20110609; DE 2011050019 W 20110609; EP 11761258 A 20110609; JP 2013514550 A 20110609; KR 20127034072 A 20110609; MX 2012014648 A 20110609; US 201113704045 A 20110609