EP 2586056 A1 20130501 - CHIP ELEMENTS MOUNTED ON WIRES HAVING AN INCIPIENT BREAKING POINT
Title (en)
CHIP ELEMENTS MOUNTED ON WIRES HAVING AN INCIPIENT BREAKING POINT
Title (de)
AUF DRÄHTEN MONTIERTE CHIPELEMENTE MIT EINEM ANBRUCHPUNKT
Title (fr)
ELEMENTS A PUCE ASSEMBLES SUR DES FILS PRESENTANT UNE AMORCE DE RUPTURE
Publication
Application
Priority
- FR 1002655 A 20100624
- FR 2011000360 W 20110623
Abstract (en)
[origin: WO2011161337A1] The invention relates to a chain comprising multiple microelectronic chip elements (10) that are rigidly connected to a wire (12a). The wire has notches (18a) that define preferred breaking points when the wire is subject to tensile stress. If the wire is a conductor, the notches (18a) can be spread in such a way that the length of the wire between a chip element and a notch is equal to the length of an antenna.
IPC 8 full level
H01L 21/98 (2006.01); G06K 19/077 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
B29C 48/05 (2019.01 - EP US); B29C 48/08 (2019.01 - EP US); B29C 48/157 (2019.01 - EP US); G06K 19/07718 (2013.01 - EP US); G06K 19/07749 (2013.01 - EP US); G06K 19/07758 (2013.01 - EP US); G06K 19/07786 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 25/0655 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H05K 7/02 (2013.01 - US); H05K 13/00 (2013.01 - US); B29C 48/15 (2019.01 - EP US); B29L 2017/00 (2013.01 - EP US); H01L 2223/6677 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48 (2013.01 - EP US); H01L 2224/85 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); Y10T 29/49002 (2015.01 - EP US)
Citation (search report)
See references of WO 2011161337A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2011161337 A1 20111229; CN 102959698 A 20130306; CN 102959698 B 20150819; EP 2586056 A1 20130501; FR 2961949 A1 20111230; FR 2961949 B1 20120803; JP 2013531298 A 20130801; US 2013077281 A1 20130328
DOCDB simple family (application)
FR 2011000360 W 20110623; CN 201180030660 A 20110623; EP 11743255 A 20110623; FR 1002655 A 20100624; JP 2013515941 A 20110623; US 201113703272 A 20110623