EP 2590743 B1 20160629 - A CHIP ASSEMBLY FOR USE IN A MICROFLUIDIC ANALYSIS SYSTEM
Title (en)
A CHIP ASSEMBLY FOR USE IN A MICROFLUIDIC ANALYSIS SYSTEM
Title (de)
CHIPANORDNUNG ZUR VERWENDUNG IN EINEM MIKROFLUIDISCHEN ANALYSESYSTEM
Title (fr)
ENSEMBLE PUCE À UTILISER DANS UN SYSTÈME D'ANALYSE MICROFLUIDIQUE
Publication
Application
Priority
- EP 11157598 A 20110310
- US 36292610 P 20100709
- EP 2011061390 W 20110706
- EP 11731321 A 20110706
Abstract (en)
[origin: WO2012004296A1] A chip assembly (100) for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip (102) having an outer wall (105), a carrier structure (104) comprising an aperture (110) for receiving the chip (102), the aperture (110) defining an inner wall (107), wherein the chip (102) is arranged in the aperture (110) with a liquid tight seal (106) between the outer wall (105) of the chip (102) and the inner wall (107) of the aperture (110). The chip (102) may have an outer diameter, which is smaller than the diameter of the aperture (110), and a gap between the chip (102) and the carrier structure (104) may be sealed with a bonding material (106), such as an UV curing adhesive. A method for manufacturing the chip assembly (100) is further disclosed.
IPC 8 full level
B01L 3/00 (2006.01)
CPC (source: EP US)
B01L 3/50 (2013.01 - US); B01L 3/502707 (2013.01 - EP US); B01L 3/5085 (2013.01 - EP US); B32B 37/1284 (2013.01 - US); C09J 5/00 (2013.01 - US); B01L 2200/0689 (2013.01 - EP US); B01L 2200/10 (2013.01 - EP US); B01L 2200/12 (2013.01 - US); B01L 2300/0645 (2013.01 - EP US); B01L 2300/0819 (2013.01 - EP US); Y10T 156/10 (2015.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012004296 A1 20120112; CA 2804564 A1 20120112; CN 103068486 A 20130424; CN 103068486 B 20150923; DK 2590743 T3 20160912; EP 2590743 A1 20130515; EP 2590743 B1 20160629; JP 2013536407 A 20130919; JP 5851500 B2 20160203; US 2013136673 A1 20130530; US 2016332160 A1 20161117; US 9975120 B2 20180522; WO 2012004297 A1 20120112
DOCDB simple family (application)
EP 2011061388 W 20110706; CA 2804564 A 20110706; CN 201180040062 A 20110706; DK 11731321 T 20110706; EP 11731321 A 20110706; EP 2011061390 W 20110706; JP 2013517374 A 20110706; US 201113809097 A 20110706; US 201615218642 A 20160725