EP 2591498 A1 20130515 - METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE
Title (en)
METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE
Title (de)
VERFAHREN ZUR CHIPMONTAGE BEI EINEM FLEXIBLEN SUBSTRAT
Title (fr)
PROCÉDÉ D'ASSEMBLAGE D'UNE PUCE DANS UN SUBSTRAT SOUPLE
Publication
Application
Priority
- FR 1002846 A 20100706
- FR 2011000395 W 20110705
Abstract (en)
[origin: WO2012007655A1] According to the invention, a substrate, provided with an electrically conductive wire (3) coated with an electrically insulating material, is impregnated with a polymerisable material (4). A reception area (5) for a chip (2) is formed on a surface of the substrate (1) by means of deformation. The reception area (5) is stiffened using the polymerisable material (4). The chip (2) is disposed in the reception area (5) and an electrical connection area (8) of the chip (2) is connected electrically to the electrically conductive wire of the substrate (1).
IPC 8 full level
H01L 21/60 (2006.01)
CPC (source: EP US)
H01L 23/4985 (2013.01 - EP US); H01L 23/562 (2013.01 - EP US); H01L 24/80 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 24/92 (2013.01 - EP US); H05K 1/189 (2013.01 - EP US); H05K 13/046 (2013.01 - EP US); H01L 23/13 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 25/0655 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/05571 (2013.01 - EP US); H01L 2224/08238 (2013.01 - EP US); H01L 2224/1134 (2013.01 - EP US); H01L 2224/16237 (2013.01 - EP US); H01L 2224/2919 (2013.01 - EP US); H01L 2224/32237 (2013.01 - EP US); H01L 2224/32238 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/80006 (2013.01 - EP US); H01L 2224/80007 (2013.01 - EP US); H01L 2224/80201 (2013.01 - EP US); H01L 2224/80903 (2013.01 - EP US); H01L 2224/81005 (2013.01 - EP US); H01L 2224/81007 (2013.01 - EP US); H01L 2224/81191 (2013.01 - EP US); H01L 2224/81201 (2013.01 - EP US); H01L 2224/81385 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2224/81903 (2013.01 - EP US); H01L 2224/83005 (2013.01 - EP US); H01L 2224/83007 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/83201 (2013.01 - EP US); H01L 2224/83385 (2013.01 - EP US); H01L 2224/8385 (2013.01 - EP US); H01L 2224/90 (2013.01 - EP US); H01L 2224/9211 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/0665 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H05K 1/0281 (2013.01 - EP US); H05K 1/038 (2013.01 - EP US); H05K 2201/10545 (2013.01 - EP US); H05K 2201/10674 (2013.01 - EP US); H05K 2203/0108 (2013.01 - EP US); Y10T 29/4913 (2015.01 - EP US)
Citation (search report)
See references of WO 2012007655A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
FR 2962593 A1 20120113; FR 2962593 B1 20140328; CN 102971841 A 20130313; EP 2591498 A1 20130515; JP 2013531897 A 20130808; JP 5951602 B2 20160713; US 2013074331 A1 20130328; US 9179586 B2 20151103; WO 2012007655 A1 20120119
DOCDB simple family (application)
FR 1002846 A 20100706; CN 201180033429 A 20110705; EP 11746593 A 20110705; FR 2011000395 W 20110705; JP 2013517432 A 20110705; US 201113702173 A 20110705