EP 2592628 A1 20130515 - CONDUCTIVE COMPOSITE MATERIAL WITH POSITIVE TEMPERATURE COEFFICIENT OF RESISTANCE AND OVER-CURRENT PROTECTION COMPONENT
Title (en)
CONDUCTIVE COMPOSITE MATERIAL WITH POSITIVE TEMPERATURE COEFFICIENT OF RESISTANCE AND OVER-CURRENT PROTECTION COMPONENT
Title (de)
LEITENDER VERBUNDSTOFF MIT POSITIVEM TEMPERATURKOEFFIZIENT DES WIDERSTANDS UND ÜBERSPANNUNGSSCHUTZELEMENT
Title (fr)
MATÉRIAU COMPOSITE CONDUCTEUR À COEFFICIENT DE TEMPÉRATURE POSITIF EN RÉSISTANCE ET COMPOSANT DE PROTECTION CONTRE LES SURINTENSITÉS
Publication
Application
Priority
- CN 201010219600 A 20100708
- CN 2010076822 W 20100913
Abstract (en)
The present invention reveals a PTC conductive composite material and the overcurrent protection device thereof. The PTC conductive composite material includes: (a) A matrix of crystalline polymer material at least, occupies 20%-70% of the volume fraction of the PTC conductive composite material. (b) One kind of conductive filler occupies 30%-80% of the volume fraction of the material. The solid solution conductive filler is uniformly dispersed in the polymer material, whose average particle size ranges from 0.1µm to 10µm, and the volume resistivity is no more than 300µ©¢cm. The overcurrent protection device prepared by using the PTC conductive composite material as described above includes two metal foils, which are made into a sandwich, separated by a layer of the PTC conductive composite material. And the advantages of the overcurrent protection device of the invention are low resistance, good reproducibility of resistance and well PTC intensity.
IPC 8 full level
H01B 1/20 (2006.01); H01B 1/24 (2006.01); H01C 7/02 (2006.01); H01C 7/13 (2006.01)
CPC (source: EP US)
H01B 1/20 (2013.01 - EP US); H01C 7/02 (2013.01 - EP US); H01C 7/027 (2013.01 - EP US); H01C 7/13 (2013.01 - EP US); H01G 11/24 (2013.01 - EP US); H02H 9/026 (2013.01 - US); Y02E 60/13 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2592628 A1 20130515; EP 2592628 A4 20150128; EP 2592628 B1 20190703; CN 101887766 A 20101117; JP 2013535804 A 20130912; JP 5711365 B2 20150430; US 2013094116 A1 20130418; US 8653932 B2 20140218; WO 2012003661 A1 20120112
DOCDB simple family (application)
EP 10854320 A 20100913; CN 2010076822 W 20100913; CN 201010219600 A 20100708; JP 2013516959 A 20100913; US 201013574712 A 20100913