Global Patent Index - EP 2595595 A1

EP 2595595 A1 20130529 - BLISTER PACKAGE WITH ADHERED CURVED SURFACE

Title (en)

BLISTER PACKAGE WITH ADHERED CURVED SURFACE

Title (de)

BLISTERPACKUNG MIT ANHAFTENDER GEKRÜMMTER OBERFLÄCHE

Title (fr)

EMBALLAGE DE PLAQUETTE THERMOFORMÉE AVEC SURFACE COURBÉE ADHÉSIVE

Publication

EP 2595595 A1 20130529 (EN)

Application

EP 11720275 A 20110511

Priority

  • US 36546610 P 20100719
  • US 2011036016 W 20110511

Abstract (en)

[origin: US2012012491A1] A package is disclosed comprising a blister attached to a paperboard card, wherein the paperboard card has a curved shaped.

IPC 8 full level

A61J 1/03 (2006.01); B31B 7/00 (2006.01); B31D 1/00 (2006.01); B65D 73/00 (2006.01); B65D 75/36 (2006.01)

CPC (source: EP US)

B65D 73/0092 (2013.01 - EP US); B31B 2105/00 (2017.07 - EP US); B31B 2120/408 (2017.07 - EP US)

Citation (search report)

See references of WO 2012012015A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 2012012491 A1 20120119; CN 102985045 A 20130320; EP 2595595 A1 20130529; WO 2012012015 A1 20120126

DOCDB simple family (application)

US 201113106049 A 20110512; CN 201180035368 A 20110511; EP 11720275 A 20110511; US 2011036016 W 20110511