EP 2596535 A1 20130529 - SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
Title (en)
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
Title (de)
HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS
Title (fr)
COMPOSANT SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT SEMI-CONDUCTEUR
Publication
Application
Priority
- DE 102010031945 A 20100722
- EP 2011061137 W 20110701
Abstract (en)
[origin: WO2012010400A1] The invention relates to a semiconductor component (1) comprising at least one optoelectronic semiconductor chip (2) and a connecting carrier (5) having a connecting surface (53) on which the semiconductor chip (2) is disposed. A reflective coating (4) and a limiting structure (3) are formed on the connecting carrier (5), wherein the limiting structure (3) at least partially encloses the semiconductor chip (2) in the lateral direction, and the reflective coating (4) at least partially extends in the lateral direction between a side surface (21) of the semiconductor chip and the limiting structure (3). The invention further relates to a method for producing a semiconductor component.
IPC 8 full level
H01L 33/46 (2010.01); H01L 33/60 (2010.01)
CPC (source: CN EP KR US)
H01L 31/0232 (2013.01 - CN KR US); H01L 31/18 (2013.01 - CN KR US); H01L 33/44 (2013.01 - KR); H01L 33/46 (2013.01 - CN EP KR US); H01L 33/58 (2013.01 - KR); H01L 33/60 (2013.01 - CN KR US); H01L 2933/0025 (2013.01 - CN EP KR US)
Citation (search report)
See references of WO 2012010400A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010031945 A1 20120126; CN 103026513 A 20130403; CN 103026513 B 20161102; CN 107104157 A 20170829; EP 2596535 A1 20130529; JP 2013531394 A 20130801; JP 5628425 B2 20141119; KR 20130058729 A 20130604; KR 20180006515 A 20180117; US 2013181247 A1 20130718; WO 2012010400 A1 20120126
DOCDB simple family (application)
DE 102010031945 A 20100722; CN 201180035938 A 20110701; CN 201610899239 A 20110701; EP 11743034 A 20110701; EP 2011061137 W 20110701; JP 2013520040 A 20110701; KR 20137004392 A 20110701; KR 20187001042 A 20110701; US 201113811524 A 20110701